Abstract: A machine (100) includes an engine (102) connected to an implement pump (204) operating an actuator and to a propel pump operating a motor (106). An electronic controller (218) is disposed to receive at least one parameter selected from the group of: a pressure of fluid at the at least one motor (106), a pressure of fluid at the at least one implement actuator, a rate of rotation of the engine (102), a rate of rotation of the at least one motor (106), and a torque output of the engine (102). The electronic controller (218) monitors the at least one parameter for a predetermined period, and determines an operating mode of the machine (100). The electronic controller (218) then adjusts an underspeed setting for the engine (102) based on the operating mode.

Abstract: A machine (100) includes an engine (102) connected to an implement pump (204) operating an actuator and to a propel pump operating a motor (106). An electronic controller (218) is disposed to receive at least one parameter selected from the group of: a pressure of fluid at the at least one motor (106), a pressure of fluid at the at least one implement actuator, a rate of rotation of the engine (102), a rate of rotation of the at least one motor (106), and a torque output of the engine (102). The electronic controller (218) monitors the at least one parameter for a predetermined period, and determines an operating mode of the machine (100). The electronic controller (218) then adjusts an underspeed setting for the engine (102) based on the operating mode.

Abstract: A method and apparatus for testing cooling units used in computers is presented. Testing of such cooling systems increases the reliability thereof, which in turn increases the reliability of the computers utilizing these cooling systems. The cooling system tester comprises a test frame which supports a plurality of evaporators, associated modular cooling units (units under test) and associated fan or blower assemblies. A heating element is attached to each of these evaporators to act as a heat load for the corresponding modular cooling unit, i.e., to simulate the heat load of an actual computer. The heat output of the heating elements are controlled by a computer. The power supplied to the modular cooling units is also regulated (controlled) by the computer. A program in the computer runs a test on each of the modular cooling units. The program checks for user input and the installation of a modular cooling unit.

Abstract: A module probe template comprises a substrate of electrically insulative material which possesses contact pads or lands which at least partially surround substrate apertures which match the pin pattern on a module to be tested. Pin shoulders make contact with the land portions in the vicinity of the apertures and a second portion of the conductive land pattern extends to the edge of the template so as to provide connections to wires which supply signals to test and/or control instrumentation. A layer of thin electrically insulative tape or other material is also preferably laid over the conductive paths with small apertures present in the insulative tape so as to provide (in one embodiment) access to the contact land near the pin holes. This test template apparatus thus makes it possible to control and/or monitor pins which are otherwise inaccessible except with much greater difficulty.

Abstract: A portable thermocouple template is built to have one or more separate thermocouple beads fixedly attached at predetermined locations on a thin insulator sheet, with appropriate tape or the like for holding each thermocouple and its pair of connector wires in position on the sheet. The template is mountable between interconnected electronic components, such as on the pin side of a multichip module, in order to monitor the temperature of the adjacent components under actual operating conditions. After the test is completed and the temperature data is recorded and/or displayed on a data logger, the template and related assembly wires are removed and stored until such time as the template is needed for mounting again in order for additional thermal tests to be conducted.