Patents by Inventor Terrence Harold Brown

Terrence Harold Brown has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of surface preparation and imaging for integrated circuits
    Patent number: 7183123
    Abstract: The present invention is a method of surface preparation and imaging for integrated circuits. First, a substrate is selected and an opening is cut in the substrate of a sufficient size to fit an integrated circuit to be analyzed. A second substrate is then selected. An adhesive film is applied to the top surface of the first substrate, the adhesive film having adhesive on both sides and covering the opening on the first substrate. An integrated circuit is then inserted into the opening and attached to the bottom side of the adhesive film. Next, the first substrate and integrated circuit are bonded to the second substrate using the adhesive film. The bottom side of the first substrate and the integrated circuit are then thinned until the substrate wafer of the integrated circuit is completely removed. Finally, an analytical imaging technique is performed on the integrated circuit from the bottom side of the first substrate.
    Type: Grant
    Filed: September 13, 2004
    Date of Patent: February 27, 2007
    Assignee: The United States of America as represented by the National Security Agency
    Inventors: Terrence Harold Brown, Larry Gene Ferguson
  • Method of surface preparation and imaging for integrated circuits
    Patent number: 7019530
    Abstract: The present invention is a method of surface preparation and imaging for integrated circuits. First, a substrate is selected and an opening is cut in the substrate of a sufficient size to fit an integrated circuit to be analyzed. A second substrate is then selected. An adhesive film is applied to the top surface of the first substrate, the adhesive film having adhesive on both sides and covering the opening on the first substrate. An integrated circuit is then inserted into the opening and attached to the bottom side of the adhesive film. Next, the first substrate and integrated circuit are bonded to the second substrate using the adhesive film. The bottom side of the first substrate and the integrated circuit are then thinned until the substrate wafer of the integrated circuit is completely removed. The bottom side of the first substrate and integrated circuit is then thinned to a user-definable level. A handle wafer is then attached to the bottom side of the first substrate.
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: March 28, 2006
    Assignee: The United States of America as represented by the National Security Agency,
    Inventors: Terrence Harold Brown, Larry Gene Ferguson