Abstract: Disclosed herein are structures and techniques for exposing circuitry in die testing. For example, in some embodiments, an integrated circuit (IC) die may include: first conductive contacts at a first face of the die; second conductive contacts at a second face of the die; die stack emulation circuitry; other circuitry; and a switch coupled to the second conductive contacts, the die stack emulation circuitry, and the other circuitry, wherein the switch is to couple the second conductive contacts to the other circuitry when the switch is in a first state, and the switch is to couple the die stack emulation circuitry to the other circuitry when the switch is in a second state different from the first state.

Abstract: A die-to-die repeater circuit includes a transmit circuit coupled to a die-to-die interconnect, the transmit circuit including at least one flip flop to function as a part of a linear feedback shift register (LFSR) to transmit a value across the die-to-die interconnect for design for test (DFT) to check proper operation of the die-to-die interconnect, and a receive circuit coupled to the die-to-die interconnect, the receive circuit including at least one flip flop to function as part of a multiple input shift register (MISR).

Abstract: Disclosed herein are structures and techniques for exposing circuitry in die testing. For example, in some embodiments, an integrated circuit (IC) die may include: first conductive contacts at a first face of the die; second conductive contacts at a second face of the die; die stack emulation circuitry; other circuitry; and a switch coupled to the second conductive contacts, the die stack emulation circuitry, and the other circuitry, wherein the switch is to couple the second conductive contacts to the other circuitry when the switch is in a first state, and the switch is to couple the die stack emulation circuitry to the other circuitry when the switch is in a second state different from the first state.

Abstract: A die-to-die repeater circuit includes a transmit circuit coupled to a die-to-die interconnect, the transmit circuit including at least one flip flop to function as a part of a linear feedback shift register (LFSR) to transmit a value across the die-to-die interconnect for design for test (DFT) to check proper operation of the die-to-die interconnect, and a receive circuit coupled to the die-to-die interconnect, the receive circuit including at least one flip flop to function as part of a multiple input shift register (MISR).

Abstract: Methods and apparatus for predictable protocol aware testing on a memory interface are are shown. An apparatus to support a protocol aware testing on a memory interface may include a digital controller to receive a plurality of read request commands from a unit under test. The digital controller further to hold the plurality of read request commands while a hold signal has a first value, and to sequentially release individual read request commands of the plurality of read request commands while to the hold signal has a second value. The digital controller further to provide input/output (I/O) commands to an output based on a particular released read request command of the plurality of read request commands. Timing of provision of the I/O commands is deterministic based on a transition of the hold signal from the first value to the second value.

Abstract: A technical solution for improving test times and costs associated with IC production includes a central test engine (CTE) functional test block integrated onto an IC. The CTE functions as a hardware abstraction layer (HAL), and provides testing capabilities by transferring a large test data file to a device under test and performing a closed-loop monitoring of receipt of the expected test data results. The CTE also reduces the number of external interfaces and interface controllers used during testing. The reduction in external interfaces reduces the size of the IC, which enables smaller and more efficient IC manufacturing, and may be used to improve small form-factor high-volume manufacturing (HVM). This reduction in IO pins also enables significant reduction in IO resources (e.g., IO drivers) within the IC, and reduces or eliminates IO test hardware dependencies.

Abstract: A technical solution for improving test times and costs associated with IC production includes a central test engine (CTE) functional test block integrated onto an IC. The CTE functions as a hardware abstraction layer (HAL), and provides testing capabilities by transferring a large test data file to a device under test and performing a closed-loop monitoring of receipt of the expected test data results. The CTE also reduces the number of external interfaces and interface controllers used during testing. The reduction in external interfaces reduces the size of the IC, which enables smaller and more efficient IC manufacturing, and may be used to improve small form-factor high-volume manufacturing (HVM). This reduction in IO pins also enables significant reduction in IO resources (e.g., IO drivers) within the IC, and reduces or eliminates IO test hardware dependencies.

Abstract: Methods and apparatus for predictable protocol aware testing on a memory interface are are shown. An apparatus to support a protocol aware testing on a memory interface may include a digital controller to receive a plurality of read request commands from a unit under test. The digital controller further to hold the plurality of read request commands while a hold signal has a first value, and to sequentially release individual read request commands of the plurality of read request commands while to the hold signal has a second value. The digital controller further to provide input/output (I/O) commands to an output based on a particular released read request command of the plurality of read request commands. Timing of provision of the I/O commands is deterministic based on a transition of the hold signal from the first value to the second value.