Patents by Inventor Terrence Meier

Terrence Meier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050263233
    Abstract: An over-molded fitment is configured for mounting to a flexible packaging material. The fitment includes a flange having first and second sides, a spout extending upwardly from the first side of the flange and an over-molded sealing media molded onto the first side of the flange. The flange and spout are integral with one another and formed from a single first material. The over-molded sealing media is formed from a second material different from the first material and having a density less than a density of the first material. The sealing media permits joining the different materials of the flexible packaging and the fitment that would otherwise not seal to one another. A method for forming the over-molded fitment and a package formed with the fitment are also disclosed.
    Type: Application
    Filed: May 6, 2005
    Publication date: December 1, 2005
    Inventors: Terrence Meier, James Zielinski, Jeffrey Stupar, Deepak Mehta