Abstract: A set of spacing clips and a method of use therefor are described. Polishing pads utilized in wafer polishing machines, such as the MirraTrak™ and MiraMesa™ polishers made by Applied Materials, Inc., must be centered on polisher's platens. The polishing pads are generally of a larger diameter than the platens, and are held on the platen by a pressure-sensitive adhesive present on the backside of the pads. Each centering clip has two surfaces that are spaced apart from each other by the distance that a polishing pad will overhang the platen when properly centered on the platen. One surface of each of two centering clips is butted up against the edge of the circular pad and clamped to the pad. As the pad is lowered into place on the circular platen, the other surface of each clip is butted against the outside edge of the platen, ensuring that the pad will be centered on the platen when the adhesive backed pad contacts the platen.

Abstract: A set of spacing clips and a method of use therefor are described. Polishing pads utilized in wafer polishing machines, such as the MirraTrak™ and MiraMesa™ polishers made by Applied Materials, Inc., must be centered on polisher's platens. The polishing pads are generally of a larger diameter than the platens, and are held on the platen by a pressure-sensitive adhesive present on the backside of the pads. Each centering clip has two surfaces that are spaced apart from each other by the distance that a polishing pad will overhang the platen when properly centered on the platen. One surface of each of two centering clips is butted up against the edge of the circular pad and clamped to the pad. As the pad is lowered into place on the circular platen, the other surface of each clip is butted against the outside edge of the platen, ensuring that the pad will be centered on the platen when the adhesive backed pad contacts the platen.