Patents by Inventor Terri J. Brownfield

Terri J. Brownfield has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip chip carrier package with adapted landing pads
    Patent number: 6683387
    Abstract: A carrier member is provided that has a plurality of landing pads thereon where at least one of the landing pads has a depression therein to hold at least one solder terminal of a device to be mounted thereto. Embodiments include a ceramic or a bismaleimide-triazine epoxy laminate carrier having an array of landing pads formed by depositing a eutectic solder, where each landing pad in the comer of the array has a depression therein.
    Type: Grant
    Filed: June 15, 2000
    Date of Patent: January 27, 2004
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Terri J. Brownfield
  • Determination of flux coverage
    Patent number: 6597444
    Abstract: A package assembly is formed by applying flux to a substrate and inspecting the applied flux to determine whether the amount applied is adequate to form reliable interconnections between a device and the substrate. Embodiments include applying a rosin based flux on a laminate substrate and inspecting the coverage of the applied flux by fluorescent spectroscopy.
    Type: Grant
    Filed: July 28, 2000
    Date of Patent: July 22, 2003
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Jonathan D. Halderman, Terri J. Brownfield
  • Removing flux residue from reflow furnace using active gaseous solvent
    Patent number: 6527164
    Abstract: A method of cleaning residue on surfaces in a reflow furnace includes introducing a solvent into the furnace chamber; reacting the solvent with the residue to form a product; and, removing the product from the furnace chamber. The solvent is gaseous, such as an etch gas. Also, the product of the reaction between the residue and the solvent can is gaseous. The gaseous product can then be exhausted from the reflow furnace. A reflow furnace for practicing the method is also disclosed.
    Type: Grant
    Filed: May 31, 2000
    Date of Patent: March 4, 2003
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Terri J. Brownfield, Jonathan D. Halderman
  • Inline flux measurement system
    Patent number: 6399902
    Abstract: This invention is directed to controlling the amount of flux dispensed onto the surface of an IC component. The component is continually weighed and data is fed back to a controller that controls the dispensing of flux onto the IC component. When the proper amount of flux is dispensed, the controller terminates the dispensing of the flux.
    Type: Grant
    Filed: August 1, 2000
    Date of Patent: June 4, 2002
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Terri J. Brownfield, Jonathan D. Halderman
  • Pattern-block flux deposition
    Patent number: 6333253
    Abstract: A method and apparatus are provided for selectively depositing flux on a plurality of flip-chip bumps arranged on a semiconductor by mounting a flux stamp on the semiconductor chip. The flux stamp has a plurality of flux holes arranged in a pattern substantially identically corresponding to the arrangement of the flip-chip bumps of the semiconductor chip. Different flux stamps are prepared for various kinds of semiconductor chips having different flip-chip bump arrangements. Flux is deposited though the flux holes of the flux stamp which selectively exposing the upper surfaces of the flip-chip bumps of the chip, thereby leaving no flux on the chip surface between the flip-chip bumps.
    Type: Grant
    Filed: October 26, 2000
    Date of Patent: December 25, 2001
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Terri J. Brownfield, Raj N. Master