Abstract: A strain monitoring system including an array of semiconductor strain gauges. Each strain gauge in the array of strain gauges includes a lithographically fabricated 4-resistor bridge for providing a voltage potential corresponding to the strain in the bridge and thin film transistors to provide addressability to each 4-resistor bridge in the array. After completion of the array of strain gauges, in preferred embodiments the array of strain gauges are transferred to polyimide film which is in turn bonded to a surface region of the component to be tested for strains. Each bridge provides voltage signals corresponding to the strain to which the material under the bridge is being subjected. In preferred embodiments control and data acquisition function are separated from the semiconductor strain gage array. Preferred embodiments the system are utilized to monitor strains on components of aircraft, especially light weight robotic aircraft.

Abstract: Improved actuated probes suitable for scanning probe lithography or microscopy, and especially direct-write nanolithography and method of fabrication thereof. In one embodiment, thermomechanically actuated cantilevers with oxide-sharpened microcast tips are inexpensively fabricated by a process that comprises low-temperature wafer bonding, such as (gold) thermocompressive bonding, eutectic or adhesive bonding. Also provided is a flexcircuit that electrically interconnects the actuated probes to external circuitry and mechanically couples them to the instrument actuator. An improved scanning probe lithography instrument, hardware and software, can be built around the actuated cantilevers and the flexcircuit. Finally, provided is an improved microfluidic circuit to deliver chemical compounds to the tips of (actuated) probes and a fabrication method for tall, high-aspect-ratio tips.

Abstract: A strain monitoring system including an array of semiconductor strain gauges. Each strain gauge in the array of strain gauges includes a lithographically fabricated 4-resistor bridge for providing a voltage potential corresponding to the strain in the bridge and thin film transistors to provide addressability to each 4-resistor bridge in the array. After completion of the array of strain gauges, in preferred embodiments the array of strain gauges are transferred to polyimide film which is in turn bonded to a surface region of the component to be tested for strains. Each bridge provides voltage signals corresponding to the strain to which the material under the bridge is being subjected. In preferred embodiments control and data acquisition function are separated from the semiconductor strain gage array. Preferred embodiments the system are utilized to monitor strains on components of aircraft, especially light weight robotic aircraft.