Patents by Inventor Terry Barrette

Terry Barrette has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip on tape die reframe process
    Patent number: 6043100
    Abstract: A die is unpackaged from a Chip on Tape by grinding off molding compound from an upper surface of the COT until the COT's leads are evenly exposed across the upper surface, selectively etching out the leads using the remaining molding compound as a mask, removing an underlying layer of gold plating, and then removing the remaining molding compound. The unpacked die can then be reframed with new leads and molding compound for failure analysis and electrical failure verification.
    Type: Grant
    Filed: April 19, 1996
    Date of Patent: March 28, 2000
    Inventors: Kevin Weaver, Terry Barrette
  • Reframed chip-on-tape die
    Patent number: 5990543
    Abstract: A die is unpackaged from a Chip on Tape by grinding off molding compound from an upper surface of the COT until the COT's leads are evenly exposed across the upper surface, selectively etching out the leads using the remaining molding compound as a mask, removing an underlying layer of gold plating, and then removing the remaining molding compound. The unpacked die can then be reframed with new leads and molding compound for failure analysis and electrical failure verification.
    Type: Grant
    Filed: August 7, 1997
    Date of Patent: November 23, 1999
    Assignee: LSI Logic Corporation
    Inventors: Kevin Weaver, Terry Barrette