Patents by Inventor Terry Cisco

Terry Cisco has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microwave directional coupler
    Patent number: 8446230
    Abstract: Directional couplers are provided. In one embodiment, the directional coupler includes first and second transmission line segments positioned on a first plane and spaced apart by a first distance, third and fourth transmission line segments positioned on a second plane and spaced apart by a second distance, the second plane spaced apart from the first plane, a first conductive segment connecting the first and third transmission line segments, and a second conductive segment connecting the second and fourth transmission line segments, where the first and second transmission line segments are configured to couple energy therebetween, and where the third and fourth transmission line segments are configured to couple energy therebetween.
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: May 21, 2013
    Assignee: Raytheon Company
    Inventors: Terry Cisco, Mary A. Teshiba
  • Tunable transmission line time delay circuit having conductive floating strip segments connected by switches
    Patent number: 8264300
    Abstract: A tunable compact time delay circuit assembly is provided.
    Type: Grant
    Filed: July 9, 2009
    Date of Patent: September 11, 2012
    Assignee: Raytheon Company
    Inventor: Terry Cisco
  • MICROWAVE DIRECTIONAL COUPLER
    Publication number: 20110291770
    Abstract: Directional couplers are provided. In one embodiment, the directional coupler includes first and second transmission line segments positioned on a first plane and spaced apart by a first distance, third and fourth transmission line segments positioned on a second plane and spaced apart by a second distance, the second plane spaced apart from the first plane, a first conductive segment connecting the first and third transmission line segments, and a second conductive segment connecting the second and fourth transmission line segments, where the first and second transmission line segments are configured to couple energy therebetween, and where the third and fourth transmission line segments are configured to couple energy therebetween.
    Type: Application
    Filed: May 28, 2010
    Publication date: December 1, 2011
    Inventors: Terry Cisco, Mary A. Teshiba
  • TUNABLE COMPACT TIME DELAY CIRCUIT ASSEMBLY
    Publication number: 20110006859
    Abstract: A tunable compact time delay circuit assembly is provided.
    Type: Application
    Filed: July 9, 2009
    Publication date: January 13, 2011
    Inventor: Terry CISCO
  • FLIP CHIP MMIC ON BOARD PERFORMANCE USING PERIODIC ELECTROMAGNETIC BANDGAP STRUCTURES
    Publication number: 20050194168
    Abstract: A hybrid assembly having improved cross talk characteristics includes a substrate having an upper surface. Conductive paths on the upper surface are provided for conducting high frequency signals. Regular polygons made of an electromagnetic band gap (EBG) material having slow wave characteristics are deposited on the upper surface and form a lattice for tessellating the upper surface. Each of the polygons has a periphery. The polygons are separated along their periphery from adjacent polygons by an interspace and are covered with an insulating material. Second polygons, also made of an electromagnetic band gap material, are deposited over the insulating material. Semiconductor structures are mounted over the second polygons. The semiconductor structures have a plurality of electrical contacts with the conductive paths. The regular polygons can be hexagons, triangles, octagons or any other combination that forms a lattice and can be printed onto the substrate.
    Type: Application
    Filed: March 5, 2004
    Publication date: September 8, 2005
    Inventors: Samuel Tonomura, Terry Cisco, Clinton Holter
  • Low temperature co-fired ceramic (LTCC) high density interconnect package with circuitry within the cavity walls
    Patent number: 5461196
    Abstract: A unitized integrally fused multilayer circuit package having a substrate, walls disposed on the substrate to form a central circuit package cavity, and circuit traces contained in the walls.
    Type: Grant
    Filed: December 2, 1992
    Date of Patent: October 24, 1995
    Assignee: Hughes Aircraft Company
    Inventors: Kathleen Virga, Terry Cisco, Joseph N. Owens, Craig Shoda