Abstract: Provided is a modular battery pack having six sides comprises a plurality of battery cells, a first and second cell holder having openings or notches to receive the ends of the battery cells, an electrical outlet connected to the plurality of battery cells, two plates attached to the sides of the cell holders, and two side housings that together form four sides of the modular battery pack, while the two plates form a fifth and a sixth side of the battery pack.

Abstract: The present invention relates to a vehicle accessibility ramp. The device is an adjustable ramp for loading pets and other animals into a vehicle in an easy and safe way for both the user and animal. This structure includes a plurality of platforms which act as ascending steps for the animal in an easy-to-follow path design. The device has the ability of unfolding into three main platforms with an additional ramp component connecting the ground to the third step platform. Furthermore, the device attaches to a standard square trailer receiver fixture and is easily transportable.

Abstract: Provided is a modular battery pack having six sides comprises a plurality of battery cells, a first and second cell holder having openings or notches to receive the ends of the battery cells, an electrical outlet connected to the plurality of battery cells, two plates attached to the sides of the cell holders, and two side housings that together form four sides of the modular battery pack, while the two plates form a fifth and a sixth side of the battery pack.

Abstract: The present invention relates to a vehicle accessibility ramp. The device is an adjustable ramp for loading pets and other animals into a vehicle in an easy and safe way for both the user and animal. This structure includes a plurality of platforms which act as ascending steps for the animal in an easy-to-follow path design. The device has the ability of unfolding into three main platforms with an additional ramp component connecting the ground to the third step platform. Furthermore, the device attaches to a standard square trailer receiver fixture and is easily transportable.

Abstract: The present invention provides a device for cooling one or more battery cells, comprising a metal coolant channel and a plastic molded part that comprises fins having surfaces that protrude radially outward and contact one or more battery cells. A battery cooling management system comprises the device, and may include structures for impact resistance, as well as one or more coolant fluid headers, coolant fluid collection channels, or one or more protective shells. A thermally conductive foam may be disposed in between a battery cell and the plastic molded device.

Abstract: Processes for in-mold coating of polymer substrates comprising: introducing a plastic substrate into a mold cavity of a mold; introducing a coating composition into the mold cavity containing the plastic substrate in order to coat the substrate, at processing temperature 50° C.-120° C., and at processing pressure 11,000 to 20,700 kPa; and curing the composition in the mold cavity at cure temperature of 62-105° C.; wherein the coating composition comprises a polymer comprising isocyanate-reactive groups; and a polyisocyanate, and wherein the coating composition has a viscosity of 200 to 500 mPa·s at the processing temperature. Further embodiments include attaching electronic circuits, light emitting diodes and/or graphic images to the plastic substrate before coating.

Abstract: Two shot injection molding processes are disclosed for making thermoplastic parts of two different compositions, the second shot composition having a higher thermal conductivity than the first, and the mold cavity surface temperature is greater than 70° C., preferably 70-100° C. In embodiments, the cavity surface temperature is within 20° C. of the Vicat temperature for the composition being injected, the cavity pressure is between 20 and 150 MPa, and the melt temperature of the second shot material is 200-400° C., or 250-340° C. The resulting molded part provides for improved thermal conductivity between the two molded compositions.

Abstract: A guitar picking device includes a first securement body, having a first lip to secure around a first finger; a second securement body, having a second lip to secure around a second finger; and a guitar pick secured between the first securement body and the second securement body; the guitar pick faces away from a user's knuckles when the first securement body and the second securement body are secured around the first and second finger.

Abstract: A method and apparatus for dynamically balancing a tire/wheel assembly of a motor vehicle is provided. The wheel of the tire/wheel assembly has raceways along the circumference of the wheel containing balancing media that provide dynamic rotational harmonic center of moment compensation for manufacturing imperfections. Balancing media may be solid bearings, fluid, or a combination thereof, and the balancing media moves along the raceways to certain areas of the wheel to compensate for the mass imbalances on the correspondingly opposing side of the wheel. The raceways have any combination of mathematically-described geometric cross-sectional area shapes, and the balancing media may be shaped accordingly. In another embodiment, the raceways may be noncontiguous and may have different orientations throughout the wheel. The present invention also provides sensors for real-time management of the balancing media to inform the driver of sudden changes in the state of the tire/wheel assembly.

Abstract: A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed.

Abstract: A telescopic shock absorber for a motorcycle includes a slider tube, a stanchion tube, a damping valve, and a hollow damping rod. The damping rod includes a lower end portion secured within the slider tube with a plurality of longitudinally offset orifices. At least one of the orifices is positioned near the valve such that the orifice moves above the valve under sufficient compressive shock to the slider tube during riding. The damping rod also includes an upper end portion extending within the lower end of the stanchion tube. A mid-portion extends between the upper and lower end portions with an outer diameter smaller than those of the end portions. Steps are provided between the mid-portion and the upper and lower end portions. The mid-portion is positioned adjacent the damping valve when the vehicle is in a static, rider-sag state.

Abstract: A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed.

Abstract: A semiconductor package comprising a non-conductive film which defines opposed top and bottom film surfaces and includes a plurality of vias disposed therein. Disposed on the top film surface is a plurality of upper leads which circumvent respective ones of the vias. Similarly, disposed on the bottom film surface is a plurality of lower leads which circumvent respective ones of the vias and are electrically connected to respective ones of the upper leads. At least one transmission line element is also disposed on the top film surface and electrically connected to at least one of the upper leads. Attached to the top film surface and electrically connected to at least one of the upper leads and the transmission line element is at least one semiconductor die. A package body at least partially covers the semiconductor die, the upper leads, the transmission line element, and the top film surface.

Abstract: A lead frame comprising a frame which defines a central opening. Disposed within the central opening is a die pad which is connected to the frame. Also connected to the frame are a plurality of leads which extend within the opening toward the die pad. Each of the leads defines opposed top and bottom surfaces, an inner end, an outer end, and an opposed pair of side surfaces. The bottom surface and the outer end collectively define a corner region of the lead. Formed within the corner region is a recess which is sized and configured to accommodate the flow of reflow solder thereinto.

Abstract: An educational board game includes a planar game board having printed thereon a movement path consisting of a contiguous series of numbered spaces. Various groups of spaces are set to receive panels from a “Theme Pack.” The “Theme Pack” itself is comprised of character image panels, illustrated panels, instruction panels and question cards directly related to a given book or subject matter. Different “Theme Packs” can be used with the same game board in order to incorporate multiple books and accommodate different age groups. A magnetic interaction between the game board and panels ensures that the latter remain in position on the board. The method of play involves correctly answering questions related to a given book or “Theme Pack” in order to advance along the movement path from start to finish.

Abstract: A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed.

Abstract: A routing system operably links a mobile platform to the Internet. The system includes a ground based communications link manager linkable to the mobile platform. At least one ground based prefix server can communicate with the communications link manager. An initial Internet address is assigned to the mobile platform. A prefix server program communicates the initial destination address of the mobile platform to the communications link manager and to the Internet. During a travel segment of the mobile platform a new destination address can be communicated to the Internet using the prefix server to maintain communication between the mobile platform and the Internet.

Abstract: A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed.

Abstract: A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed.

Abstract: A lead frame comprising a frame which defines a central opening. Disposed within the central opening is a die pad which is connected to the frame. Also connected to the frame are a plurality of leads which extend within the opening toward the die pad. Each of the leads defines opposed top and bottom surfaces, an inner end, an outer end, and an opposed pair of side surfaces. The bottom surface and the outer end collectively define a corner region of the lead. Formed within the corner region is a recess which is sized and configured to accommodate the flow of reflow solder thereinto.