Abstract: A monitor, which may be closely associated with a handrail, may determine the amount of force applied to the handrail. The monitor may also determine the pattern in which force is applied to the handrail in order to assess how the user is contacting the handrail. The user's application of force to the handrail can be monitored along the course of movement along the handrail and may be compared to historical usage patterns.

Abstract: A device, system and method for analyzing a user's motion using a piezoelectric film to generate a plurality of deformation signals based upon an associated plurality of deformations, an EEPROM to record data associated with the plurality of deformation signals, and a transceiver to receive at least a portion of the recorded data from the EEPROM and to transmit data, wherein the analysis may determine an abnormality in the user's gait.

Abstract: An embodiment of the invention relates to a sampling circuit comprising at least one clock, a reference trace, a sensor trace adapted to be connected to a sensing element, and a device to measure a length of delay between a reference signal transmission time of a reference signal transmitting through the reference trace and a sensed signal transmission time of a sensed signal transmitting through the sensor trace, wherein the length of delay is determined by counting the number of burst tones occurring during the length of delay.

Abstract: Briefly, in accordance with one or more embodiments, the location of a mobile device within a floor plan of a building or the like environment may be determined using a single transmission link between transceiver and the mobile device. A bit error rate value and a receiver signal strength indication value are measured for the present location of the mobile device in the floor plan. The coordinates where the mobile device is located may be determined by looking up the measured bit error rate value and the received signal strength indication value in a lookup table. Due to environmental factors of the floor plan, the combination of the bit error rate value and the received signal strength indication value corresponds to a unique coordinate location in the floor plan from which the location of the mobile device may be determined.

Abstract: Briefly, in accordance with one or more embodiments, a kinematic sensor may be carried by or on one or more body segments of a user to obtain one or more kinematic variables based at least in part on movement of the user with respect to a fixed, global reference system. The kinematic sensor comprises a tri-axial accelerometer sensor, a gyroscope sensor, and a magnetometer sensor to define the global reference system and to obtain kinematic data. The kinematic data may be transmitted via a wireless link to a remote information handling system or device, for example to monitor a health status of the user based at least in part on movement of the user with respect to the fixed, global reference system.

Abstract: Briefly, in accordance with one or more embodiments, a user experiencing cognitive decline or a similar affliction may be assisted with the performance of daily tasks or routines. An information handling system installed in a central room of the user's living quarters, such as a kitchen, to observe the user and determine if the user is having difficulty completing the task or routine. If it is determined that the user is experiencing difficulty, the information handling system may provide one or more cues to the user to assist the user in remembering what the user has just completed in order to indicate to the user what part of the task remains to be completed. For example, the steps recently taken by the user may be retraced by projecting an image of those footsteps onto the floor to show the user where she has recently been.

Abstract: This invention relates to the field of remotely controlling the mobile computing device. It further relates to an apparatus and method of at least replicating in a portable pen-like device the ability to control a portable computing device to the same extent as the level of control attainable by a standard PC keyboard when attached to a standard PC; and relates to various embodiments of the apparatus and method.

Abstract: The invention relates to an earpiece form factor including technology to monitor physiological, activity and environmental data on a user. The device includes a pulse oximeter unit to provide blood oxygenation level and beat-to-beat timing, a three-axis accelerometer to provide orientation and activity level, and a temperature sensor to provide a subject's skin temperature. The device may also capture other forms of data for the user and the user's surroundings. Captured data are transmitted wirelessly to a mobile phone, PDA or other device that supports wireless transmission, and enables monitoring form another location.

Abstract: A system and method for determining the orientation of an object using one or more RFID tags on the object; and an RFID reader to determine the orientation of the object; wherein the RFID reader is configured to emit a signal to activate at least one of the RFID tags, receive return signals from the RFID tags that are activated, and determine the orientation of the object based on relative signal strengths of the received signals, and the system may be a visospatial testing system.

Abstract: A device, system and method for analyzing a user's motion using a piezoelectric film to generate a plurality of deformation signals based upon an associated plurality of deformations, an EEPROM to record data associated with the plurality of deformation signals, and a transceiver to receive at least a portion of the recorded data from the EEPROM and to transmit data, wherein the analysis may determine an abnormality in the user's gait.

Abstract: A device containing a printed wire board (PWB), wherein the PWB comprises a fluid channel, wherein the fluid channel is a closed channel having a noble metal-containing layer on a surface of the fluid channel is disclosed. A method of making a device containing providing a substrate of a PWB; and fabricating a fluid channel in the PWB, wherein the fluid channel is a closed channel having a noble meal-containing layer on a surface of the fluid channel is disclosed. Also, a method containing providing a printed wire board (PWB), wherein the PWB comprises a fluid channel, wherein the fluid channel is a closed channel having a noble metal-containing layer on a surface of the fluid channel, and flowing fluid the fluid channel is disclosed.

Abstract: Methods and apparatuses for monitoring user interactions with an electronic device for indications of a degenerative condition.

Abstract: A microchannel cooling system used to cool integrated circuits may include a number of microchannels which may be subject to bubble blockage. When bubble formation or nucleation occurs due to heating, the bubbles may become trapped within the microchannels. A valve within the microchannel may automatically operate, at least partially, to close off the microchannel, allowing the bubble to be freed and to be flushed from the channel in some embodiments.

Abstract: A therapeutic agent may be dispensed into a biological fluid on an as needed basis. A microelectromechanical system valve may dispense the therapeutic agent as needed. The valve may sense the extent of the need for the therapeutic agent and may controllably open to provide that therapeutic agent in response thereto.

Abstract: A circuit board includes two planes. A via spans the planes, and an impedance component is placed in the via. The impedance component is coupled to both of the planes. The impedance component provides an impedance between the planes without the use of traces or hand soldering of components.

Abstract: A radio frequency identification (RFID) device may incorporate an existing feature on a substrate as an antenna. In some embodiments, the electromagnetic interference (EMI) guard ring on a substrate may form the antenna for the RFID device.

Abstract: A side-mounted capacitor for a semiconductor die package is described. In one embodiment, a substrate has a die side to which an IC (integrated circuit) may be attached, and an edge adjacent the die side. A bypass capacitor is attached to the package substrate edge.

Abstract: A cap may be provided over the hinged cover of an integrated circuit socket to be surface mounted to a printed circuit board. The cap may protect the socket prior to the insertion of the integrated circuit. It may also facilitate the surface mounting of the socket to a printed circuit board. It may do so in at least two ways. The cap may facilitate convective heating by the provision of a series of openings in the cap. The cap may also be infrared transmissive so that infrared radiation from a surface mount oven passes through the cap to heat the socket. As a result, in some embodiments, better reflow is achieved and higher solder ball reliability may result.

Abstract: According to one aspect of the invention, an electronic assembly and a method for constructing an electronic assembly are provided. Insulating bodies interconnect a heat sink plate, or support plate, and a plurality of support members to form a heat sink assembly. The heat sink assembly is placed on a circuit board along with a semiconductor package. The entire circuit board is heated to solder the heat sink assembly and the semiconductor package to the circuit board. The insulating bodies thermally separate the heat sink plate and the support members so that heat is not conducted from the support members to the heat sink plate, and the heat sink plate and semiconductor package may be attached to the circuit board in a one-step heating process.

Abstract: According to one aspect of the invention, an electronic assembly and a method for constructing an electronic assembly are provided. Insulating bodies interconnect a heat sink plate, or support plate, and a plurality of support members to form a heat sink assembly. The heat sink assembly is placed on a circuit board along with a semiconductor package. The entire circuit board is heated to solder the heat sink assembly and the semiconductor package to the circuit board. The insulating bodies thermally separate the heat sink plate and the support members so that heat is not conducted from the support members to the heat sink plate, and the heat sink plate and semiconductor package may be attached to the circuit board in a one-step heating process.