Abstract: A solder system includes a lead (Pb) indicator and a solder flux. A method for forming a semiconductor device includes providing a carrier, applying the solder system to the carrier, coupling the terminal to the carrier via the solder system, melting the solder system to attach the terminal to the carrier and form a completed semiconductor device, and determining if the completed semiconductor device has a different predetermined property from the solder system.

Abstract: Improved electro-mechanical connections between a packaged semiconductor die (12) and a printed circuit board (60) with reduced standoff height and pitch are created by the use of a non-planar semiconductor package substrate (24) having a surface with angulated portions. Electrically conductive surfaces (54) are formed over the angulated portions. In one embodiment, the electrically conductive surfaces may be formed by forming an electrically conductive surface (54) over a non-planar or angulated package substrate (42). The electrically conductive angulated surfaces improve reliability of solder joints (70) upon connecting the packaged semiconductor die to the printed circuit board (60). The gaps within the solder mask openings provide a thin profile and improved pitch. In one form, the die may be on a same side of the package as the angulated substrate surface.

Abstract: Improved electro-mechanical connections between a packaged semiconductor die (12) and a printed circuit board (60) with reduced standoff height and pitch are created by the use of a non-planar semiconductor package substrate (24) having a surface with angulated portions. Electrically conductive surfaces (54) are formed over the angulated portions. In one embodiment, the electrically conductive surfaces may be formed by forming an electrically conductive surface (54) over a non-planar or angulated package substrate (42). The electrically conductive angulated surfaces improve reliability of solder joints (70) upon connecting the packaged semiconductor die to the printed circuit board (60). The gaps within the solder mask openings provide a thin profile and improved pitch. In one form, the die may be on a same side of the package as the angulated substrate surface.

Abstract: A semiconductor device (50) includes a semiconductor die (52) having electronic circuitry that is connected to a substrate (54). The substrate (54) is used to interface the semiconductor die (52) to a printed circuit board (64). The substrate (54) includes a plurality of bonding pads (56, 58). A first portion of the plurality of bonding pads are soldermask defined (SMD) bonding pads (56) and a second portion of the plurality of bonding pads are non-soldermask defined (NSMD) bonding pads (58). Using a combination of SMD and NSMD bonding pads provides the advantages of good thermal cycling reliability and good bending reliability over devices that have only SMD bonding pads or NSMD bonding pads.

Abstract: A semiconductor device (50) includes a semiconductor die (52) having electronic circuitry that is connected to a substrate (54). The substrate (54) is used to interface the semiconductor die (52) to a printed circuit board (64). The substrate (54) includes a plurality of bonding pads (56, 58). A first portion of the plurality of bonding pads are soldermask defined (SMD) bonding pads (56) and a second portion of the plurality of bonding pads are non-soldermask defined (NSMD) bonding pads (58). Using a combination of SMD and NSMD bonding pads provides the advantages of good thermal cycling reliability and good bending reliability over devices that have only SMD bonding pads or NSMD bonding pads.

Abstract: A semiconductor device (50) includes a semiconductor die (52) having electronic circuitry that is connected to a substrate (54). The substrate (54) is used to interface the semiconductor die (52) to a printed circuit board (64). The substrate (54) includes a plurality of bonding pads (56, 58). A first portion of the plurality of bonding pads are soldermask defined (SMD) bonding pads (56) and a second portion of the plurality of bonding pads are non-soldermask defined (NSMD) bonding pads (58). Using a combination of SMD and NSMD bonding pads provides the advantages of good thermal cycling reliability and good bending reliability over devices that have only SMD bonding pads or NSMD bonding pads.