Patents by Inventor Terry Edward Burnette

Terry Edward Burnette has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for multiplexed joining of solder bumps to various substrates during assembly of an integrated circuit package
    Patent number: 6117759
    Abstract: Multiplexed joining of solder bumps to various substrates for assembly of an integrated circuit package includes placing a semiconductor substrate (312) having solder bump structures (314) in contact with a ceramic substrate (320 having chip pads (322, 334), and placing this structure in contact with ball grid array spheres (352) in order to form a CBGA (360) in a single flow process.
    Type: Grant
    Filed: January 3, 1997
    Date of Patent: September 12, 2000
    Assignee: Motorola Inc.
    Inventors: Stuart E. Greer, David Clegg, Terry Edward Burnette