Abstract: An environmentally responsible system and method of reusing discarded guardrail materials to provide affordable, high-strength barriers and fencing. Discarded guardrails, guardrail posts, and guardrail blockouts are resized and reconfigured to provide barriers for use in alternative applications, such as agrifencing, where the high-strength, durability, and low cost of these formerly DOT-approved guardrail materials provide superior performance to wood and thin metal barriers. The invention also greatly increases the return on investment of state DOTs by providing an aftermarket for used guardrail materials, thereby allowing state DOTs to recover much of the initial costs, which can then be used to offset future costs in order facilitate more highway improvement projects.

Abstract: An environmentally responsible system and method of reusing discarded guardrail materials to provide affordable, high-strength barriers and fencing. Discarded guardrails, guardrail posts, and guardrail blockouts are resized and reconfigured to provide barriers for use in alternative applications, such as agrifencing, where the high-strength, durability, and low cost of these formerly DOT-approved guardrail materials provide superior performance to wood and thin metal barriers. The invention also greatly increases the return on investment of state DOTs by providing an aftermarket for used guardrail materials, thereby allowing state DOTs to recover much of the initial costs, which can then be used to offset future costs in order facilitate more highway improvement projects.

Abstract: Surface Volatile Material Detector including a vacuum chamber that is adapted to hold a silicon wafer for testing. The surface of the wafer is exposed to a heat source which evaporates the volatile contaminants on the surface of the wafer. A gas composition analyzer samples the atmosphere within the chamber to detect the evaporated contaminants. The device is designed such that the wafer is thermally insulated from the chamber, whereby the wafer is heated while the chamber walls remain cool, and any contaminants which might exist on the walls of the chamber are not evaporated. In the preferred embodiment, the wafer is heated by infrared light illumination.

Abstract: A process for preparing high step coverage silicon dioxide coatings on semiconductor wafers comprising the placing of the wafer to be coated in a process chamber, introducing disilane and nitrous oxide into the process chamber and maintaining the wafer in an atmosphere consisting essentially of a gaseous mixture of disilane and nitrous oxide and initiating and maintaining plasma enhanced chemical vacuum deposition of silicon dioxide from said gaseous mixture by applying radio frequency energy to the wafer to create a plasma adjacent the surface of said wafer is disclosed.