Patents by Inventor Terry G. Davis

Terry G. Davis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • In mold electronic printed circuit board encapsulation and assembly
    Patent number: 11112103
    Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: September 7, 2021
    Assignees: Covestro LLC, Thermal Solution Resources, LLC
    Inventors: Terry G. Davis, David Rocco, Mikhail Sagal, Jessee McCanna, Nicolas Sunderland, James Lorenzo, Mark Matsco, Kevin Dunay
  • IN MOLD ELECTRONIC PRINTED CIRCUIT BOARD ENCAPSULATION AND ASSEMBLY
    Publication number: 20190093874
    Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.
    Type: Application
    Filed: November 8, 2018
    Publication date: March 28, 2019
    Inventors: Terry G. Davis, David Rocco, Mikhail Sagal, Jessee McCanna, Nicolas Sunderland, James Lorenzo, Mark Matsco, Kevin Dunay
  • In mold electronic printed circuit board encapsulation and assembly
    Patent number: 10156352
    Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.
    Type: Grant
    Filed: April 16, 2014
    Date of Patent: December 18, 2018
    Assignees: COVESTRO LLC, THERMAL SOLUTION RESOURCES, LLC
    Inventors: Terry G. Davis, David Rocco, Mikhail Sagal, Jessee McCanna, Nicolas Sunderland, James Lorenzo, Mark Matsco, Kevin Dunay
  • A DEVICE AND MATERIALS FOR COOLING BATTERY CELLS
    Publication number: 20180219265
    Abstract: The present invention provides a device and materials for cooling one or more battery cells, wherein a cooling fluid may be used on one side of a cooling channel of the device, which separates the batteries from the cooling fluid and supports the battery cells to remain in a particular position during the anticipated movement of an automobile or other vehicle.
    Type: Application
    Filed: October 14, 2016
    Publication date: August 2, 2018
    Inventors: Ignacio Osio, Terry G. Davis
  • IN MOLD ELECTRONIC PRINTED CIRCUIT BOARD ENCAPSULATION AND ASSEMBLY
    Publication number: 20160084490
    Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.
    Type: Application
    Filed: April 16, 2014
    Publication date: March 24, 2016
    Inventors: Terry G. DAVIS, David ROCCO, Mikhail SAGAL, Jessee MCCANNA, Nicolas SUNDERLAND, James LORENZO, Mark MATSCO, Kevin DUNAY
  • Multilayer assembly as reflector
    Publication number: 20130216859
    Abstract: The present invention relates to a multilayer assembly for use as a mirror/reflector in the sector of CPV (concentrating photovoltaics) and CSP (concentrating solar power). The multilayer assembly contains a substrate layer, a barrier layer, a reflective metallic layer, an oxidic layer and one other layer, which can be a plasma polymer layer or a highly refractive metal oxide layer.
    Type: Application
    Filed: February 20, 2012
    Publication date: August 22, 2013
    Applicants: Bayer MaterialScience AG, Bayer MaterialScience LLC
    Inventors: Timo Kuhlmann, Michael Wagner, Oser Rafael, Terry G. Davis, Ignacio Osio
  • LED HEADLAMP COOLING SYSTEM
    Publication number: 20110310631
    Abstract: The present invention provides improved LED headlamp cooling systems. The present invention allows for heat removal and recirculation of the excess heat into a forward lamp chamber of a head lamp before being exhausted out of the head lamp assembly.
    Type: Application
    Filed: June 15, 2011
    Publication date: December 22, 2011
    Applicant: Bayer MaterialScience LLC
    Inventor: Terry G. Davis
  • Vehicle body side guard
    Patent number: D335271
    Type: Grant
    Filed: August 9, 1990
    Date of Patent: May 4, 1993
    Inventor: Terry G. Davis