Patents by Inventor Terry J. Dishongh

Terry J. Dishongh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microfluidic cooling of integrated circuits
    Patent number: 7652372
    Abstract: A microchannel cooling system used to cool integrated circuits may include a number of microchannels which may be subject to bubble blockage. When bubble formation or nucleation occurs due to heating, the bubbles may become trapped within the microchannels. A valve within the microchannel may automatically operate, at least partially, to close off the microchannel, allowing the bubble to be freed and to be flushed from the channel in some embodiments.
    Type: Grant
    Filed: April 11, 2005
    Date of Patent: January 26, 2010
    Assignee: Intel Corporation
    Inventors: Terry J. Dishongh, Jason T. Cassezza, Kevin S. Rhodes
  • Capacitor placement for integrated circuit packages
    Patent number: 7230317
    Abstract: A side-mounted capacitor for a semiconductor die package is described. In one embodiment, a substrate has a die side to which an IC (integrated circuit) may be attached, and an edge adjacent the die side. A bypass capacitor is attached to the package substrate edge.
    Type: Grant
    Filed: September 8, 2004
    Date of Patent: June 12, 2007
    Assignee: Intel Corporation
    Inventors: Tom E. Pearson, Terry J. Dishongh, David Amir, Damion Searls