Abstract: The invention includes deposition apparatuses having reaction chambers and particle-trapping features formed along one or more surfaces within the chambers. In particular aspects, the particle-trapping features can comprise a pattern of bent projections forming receptacles, and can comprise microstructures on the bent projections. The invention also includes methods of forming particle-trapping features by initially forming a pattern of projections, bending the projections, and then exposing the projections to particles to form microstructures on the bent projections.