Abstract: An apparatus is provided having an integrated circuit device disposed on a printed circuit board and a heat dissipation device on the integrated circuit device. An actuation screw in a spring plate is urged against a portion of the heat dissipation device by tightening the actuation screw. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, a method is provided in which the actuation screw is tightened, but prevented from being tightened beyond the mechanical constraint.

Abstract: A method and apparatus for applying a specified compressive force by a heat dissipation device for an integrated circuit are given, including placing the integrated circuit device onto a printed circuit board and then placing the heat dissipation device onto the integrated circuit device. The method includes tightening an actuation screw in a spring plate against a portion of the heat dissipation device. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, the specific compressive force may be less than or equal to a maximum pressure which may be exerted on the integrated circuit device.

Abstract: An expansion module for use in a computer system is disclosed. The expansion module holds a first card, which has a data processing unit and associated memory coupled together via a high speed internal local bus and an external coupler for an external peripheral device. An expansion coupler is also provided for coupling a second expansion card to the first card. The expansion module has a system connector for connecting the expansion module to a lower speed input-output bus of a computer system. The module can also accommodate additional SIMM modules as its associated memory. The module uses sidewalls or book covers made of a shielding material to provide electrical shielding and protection from external conditions. The expansion module improves the upgradeability and expandability of a data processing system.