Abstract: A bumped substrate assembly comprising an alumina substrate a layer of copper on the alumina substrate, and a heterogeneous juncture band between the alumina the copper layer. Copper bumps integrally connected to the copper layer extend therefrom; the copper in the copper layer and the copper bumps is substantially identical. The heterogeneous juncture band has a copper-wetted surface area that is at least about twice the apparent surface area of the copper overlying the first juncture band and consisting essentially of alumina grains unitary with the copper layer and being constituted by finger-like copper protuberances unitary with the copper layer and occupying the space between the alumina grains.

Abstract: Novel catalytic electrode in which the oxidation catalyst is protected from unfavorable redox potentials by an insulation/rectification matrix composed of a polymeric matrix containing an insulating and rectifying effective amount of a dispersed redox conductor.