Abstract: An electronics/heat sink housing used in combination with a loudspeaker or powered speaker having an enclosure, a passive radiator, and an electronics package. The electronics/heat sink housing includes a planar back plate, a top plate, two side plates, and a bottom connector plate. The housing is mounted directly onto a rear panel of the speaker enclosure over the electronics package and passive radiator of the speaker. A plurality of slots are formed within the electronics/heat sink housing, preferably along the side plates and top plate of the housing, where they are bent relative to the back plate. A plurality of larger slots also may be formed along the side plates of the housing. The total area of these slots is greater than the area of the passive radiator, so that the enclosure does not interfere with air movement and sound pressure wave propagation from the passive radiator. Air movement caused by the passive radiator serves to enhance the thermal cooling of the electronic components.

Abstract: A passive radiator assembly for a speaker that substantially reduces diaphragm resonance in the operating frequency range of the device. The new passive radiator assembly includes a quasi-elliptical shaped laminated honeycomb diaphragm, which is damped by an integral outer compliance (suspension) made of an elastomeric material that covers the entire upper surface of the diaphragm. The integrated outer compliance is of a progressive type, having a stiffness that increases in a controlled fashion during large excursions. To prevent non-linear rocking movements and compensate for displacement non-linearities, at least one, and preferably two, opposed spiders supported by a spider assembly frame are used to provide a restoring force applied to the diaphragm.