Abstract: An integrated circuit package includes an integrated circuit chip, a substrate which holds the chip, and a heat conduction mechanism which provides a path for conducting heat from the chip to a fluid medium; wherein the heat conduction mechanism is characterized as having a pressed joint which is comprised of: 1) a member that is made primarily of aluminum or copper, having a solid polysiloxane coating of less than 200.ANG. thickness, and 2) a liquid metal alloy in contact with the coating. This solid coating, on the aluminum or copper member, is fabricated without any expensive equipment by the steps of: 1) forming a liquid coating of a polysiloxane solution on the aluminum or copper member; and 2) baking that member with its liquid coating at temperatures of 100.degree. C.-300.degree. C. for 0.5 hours-3.0 hours. Thereafter the integrated circuit package is completed by placing the member with its solid coat in the heat conducting path such that a liquid metal alloy is in contact with the solid coat.

Abstract: A reflux indicating device for a urine collection bag which has a chamber for collecting urine from a patient. A receiving conduit is in communication with the drain tube on a catheter to empty urine into the chamber. An annular channel is secured into the upper distal most end of the receiving conduit. If the bag is laid on one of its sides, urine will get trapped in the channel and alert medical personnel of possible retrograde contamination of the drain tube and catheter by bacteria contained within any urine already in the chamber.