Abstract: An integrated circuit interposer includes a semiconductor substrate layer; a first metal contact layer including a first metal contact section that includes metal contacts arranged for electrically coupling to a first semiconductor die in a controlled collapsed chip connection, and a second metal contact section that includes metal contacts arranged for electrically coupling to a second semiconductor die in a controlled collapsed chip connection. A first patterned layer includes individually photomask patterned metal path sections. A second patterned layer includes individually photomask patterned waveguide sections, including a first waveguide that crosses at least one boundary between individually photomask patterned waveguide sections.

Abstract: Example inventions detect and treat an occurrence of an apnea event during a sleep period of a user. Example inventions receive data corresponding to nasal air pressure of the user and/or audio of the user during the sleep period. Example inventions determine patterns in the data, based on the patterns, detect the apnea event and, in response to the detecting, treat the apnea event.