Abstract: Embedded check-valve manufacturing assembly (100, 600) for integration in a micro-fluidic system. The assembly can include a check-valve chamber (104, 604), an inlet port (106, 606) and an outlet port (108, 608) formed from at least one layer of an low-temperature co-fired ceramic (LTCC) tape to form a substrate (102, 602). A fired LTCC plug (114, 614) is disposed within the check-valve chamber.

Abstract: Embedded check-valve manufacturing assembly (100, 600) for subsequent firing and integration in a micro-fluidic system. The assembly can include a check-valve chamber (104, 604), an inlet port (106, 606) and an outlet port (108, 608) formed from at least one layer of an unfired low-temperature co-fired ceramic (LTCC) tape to form a substrate (102, 602). A plug (114, 614) is disposed within the check-valve chamber that is capable of withstanding the LTCC firing process without damage or distortion.

Abstract: Embedded capacitors and a method for manufacturing the embedded capacitors. The method can include the steps of forming at least one bore (115) in a dielectric substrate (100). The dielectric substrate can be mechanically punched or laser cut to form the bore. The bore can be filled with a conductive material (250) to form a first electrode (470). A conductor (360) can be formed on the dielectric substrate, the conductor not being electrically continuous with the first electrode. A depth and/or cross sectional area of the bore can be selected to provide a desired amount of capacitive coupling between the electrode and the conductor. At least a second bore can be formed in the dielectric substrate and filled with a conductive material to form a second electrode. The second electrode can be electrically connected to the first electrode.

Abstract: Embedded check-valve assembly (100, 600) for integration in a micro-fluidic system. The assembly can include a check-valve chamber (104, 604), an inlet port (106, 606) and an outlet port (108, 608) formed from at least one layer of liquid crystal polymer (LCP) film to form a substrate (102, 602). A plug (114, 614) is disposed within the check-valve chamber.

Abstract: Embedded capacitors and a method for manufacturing the embedded capacitors. The method can include the steps of forming at least one bore (115) in a dielectric substrate (100). The dielectric substrate can be mechanically punched or laser cut to form the bore. The bore can be filled with a conductive material (250) to form a first electrode (470). A conductor (360) can be formed on the dielectric substrate, the conductor not being electrically continuous with the first electrode. A depth and/or cross sectional area of the bore can be selected to provide a desired amount of capacitive coupling between the electrode and the conductor. At least a second bore can be formed in the dielectric substrate and filled with a conductive material to form a second electrode. The second electrode can be electrically connected to the first electrode.