Abstract: A processor chip is tested by placing it on a modified system motherboard within a system test station The modified motherboard is able to operate as a fully functional PC motherboard with an operating system and application software. A socket is provided to allow the easy addition and removal of processor chips under test The test program for testing a processor chip is exercised as an application program and monitors and reports status of the test to the system test controller A thermal unit with a built in temperature controller is coupled to the system motherboard as via an I/O connector.

Abstract: An apparatus and method for measuring microprocessor case temperatures during testing. A groove is formed on a top surface of a lid covering a microprocessor, extending from an edge of the lid toward the center of the lid, in order to accept an insulated portion of a thermocouple. Depending on the size and shape of a sensing end of the thermocouple, either a step or notch may be formed at the interior end of the groove, near the center of the lid, to accept a sensing end of the thermocouple. Microprocessor case temperature is sensed during testing by the thermocouple, which is placed, and optionally bonded, within the groove and the step or notch.

Abstract: Parametric test data is taken on a sampled set of a particular integrated circuit (IC) using both an Automatic Test Equipment (ATE) tester and a system test motherboard. The parametric test data comprises maximum operating frequency, maximum operating temperature and minimum operating power supply voltage. A maximum operating frequency is determined at a particular fixed operating temperature and power supply voltage. A maximum operating temperature is determined at a particular fixed operating frequency and power supply voltage. Finally, a minimum operating power supply voltage is determined at a particular fixed operating frequency and temperature. Multiple two parameter graphs are plotted and the slope or numerical derivative for each plot is calculated as conversion factors. During a normal production run for the particular IC performance limit data is taken on the ATE tester comprising the same three parameters of maximum operating frequency at a particular temperature and power supply voltage.