Abstract: Drilling holes in structures using two different lasers allows a precise hole to be formed quickly. While one laser cuts a hole quickly, a second laser precisely shapes the hole. One useful application of such a method is drilling holes in multilayered structures such as Printed Wiring Boards (PWBs). One laser can precisely remove a first layer (copper) and a portion of a second layer (dielectric material). During this removal the shape of the hole is precisely formed. A second laser can remove the remaining portion of the second layer, exposing a third layer (copper). The use of the second laser can allow rapid removal of the remaining portion of the second layer. When cutting through a PWB, the second laser can be of a type that minimally damages the third copper layer.

Abstract: Drilling holes in structures using two different lasers allows a precise hole to be formed quickly. While one laser cuts a hole quickly, a second laser precisely shapes the hole. One useful application of such a method is drilling holes in multilayered structures such as Printed Wiring Boards (PWBs). One laser can precisely remove a first layer (copper) and a portion of a second layer (dielectric material). During this removal the shape of the hole is precisely formed. A second laser can remove the remaining portion of the second layer, exposing a third layer (copper). The use of the second laser can allow rapid removal of the remaining portion of the second layer. When cutting through a PWB, the second laser can be of a type that minimally damages the third copper layer.