Patents by Inventor Terry Parde

Terry Parde has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250137722
    Abstract: A chamber body includes a ceramic weldment having an upper wall, a sidewall, and a lower wall. The upper wall is coupled to the sidewall by a sidewall-to-upper wall weld and includes an upper wall rib segment coupled to an upper wall plate by an upper wall rib segment weld. The sidewall is coupled to the lower wall by a sidewall-to-lower wall weld. The lower wall has a lower wall plate portion and a lower wall rib portion extending therefrom both formed from a singular ceramic workpiece using a subtractive manufacturing technique, the lower wall plate portion thereby defining a lower wall unwelded ribbed region including a plurality of lower wall rib segments defined by the lower wall rib portion of the lower wall. Chamber arrangements, semiconductor processing systems, and methods of making ceramic weldments for chamber bodies in chamber arrangement and semiconductor processing systems are also described.
    Type: Application
    Filed: October 28, 2024
    Publication date: May 1, 2025
    Inventors: Felix Rabinovich, Terry Parde, Gary Urban Keppers, Amin Azimi, Alicia Almeda, Fauhmee Oudeif
  • Publication number: 20250137134
    Abstract: A chamber body includes a ceramic weldment. The ceramic weldment has an upper wall, a sidewall, a lower wall, and a lower wall rib segment. The sidewall is coupled to the upper wall by a sidewall-to-upper wall weld, the lower wall coupled to the sidewall by a sidewall-to-lower wall weld and defining a passthrough, and the lower wall rib segment is coupled to the lower wall plate by a lower wall rib segment weld. The upper wall has an upper wall plate portion and an upper wall rib portion through that define an upper wall unwelded ribbed region, overlay the passthrough, and which is formed using a singular ceramic workpiece using a subtractive manufacturing technique. Chamber arrangements, semiconductor processing systems, and methods of making ceramic weldments are also described.
    Type: Application
    Filed: October 28, 2024
    Publication date: May 1, 2025
    Inventors: Felix Rabinovich, Terry Parde, Gary Urban Keppers, Amin Azimi, Alicia Almeda, Fauhmee Qudelf
  • Publication number: 20250137723
    Abstract: A chamber body includes a ceramic weldment having a lower wall, a sidewall, and an upper wall. The sidewall is coupled to the lower wall by a sidewall-to-lower wall weld and the upper wall is coupled to the sidewall by a sidewall-to-upper wall weld. The upper wall has an upper wall plate portion and an upper wall rib portion extending therefrom formed from a singular quartz workpiece using a subtractive manufacturing technique, the upper wall further having a unwelded ribbed region overlying the lower wall. Chamber arrangements, semiconductor processing systems and related methods of making chamber bodies and depositing material layers onto substrates supported within chamber bodies are also described.
    Type: Application
    Filed: October 28, 2024
    Publication date: May 1, 2025
    Inventors: Felix Rabinovich, Terry Parde, Gary Urban Keppers, Amin Azimi, Alicia Almeda, Fauhmee Oudeif, Amir Kajbafvala, Arun Murali, Frederick Aryeetey, Alexandros Demos, Nayna Khosla, Caleb Miskin, Hichem M'Saad, Shivaji Peddeti, Steven Reiter
  • Publication number: 20120073752
    Abstract: Methods and systems are provided for retrofitting wafer etching systems. The methods and systems use an adapter ring to retrofit wafer etching systems designed for use with multiple piece electrodes such that single piece electrodes can be used in the etching systems. A portion of the adapter ring is disposed in a receptacle formed in a thermal coupled plate in the wafer etching system. Another portion of the adapter ring is positioned in a channel formed in an upper electrode.
    Type: Application
    Filed: September 20, 2011
    Publication date: March 29, 2012
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventor: Terry Parde