Abstract: An embodied step-up toroidal transformer (100). The step-up toroidal transformer (100) includes a plurality of coil segments (102, 104, 106, 108). Each primary coil segment (102, 104, 106, 108) is separately comprised of a plurality of turns of an elongated conductor coiled around a toroidal shaped core (120). The plurality of primary coil segments (102, 104, 106, 108) are collectively disposed around a circumference defined by the toroidal shaped core (120). Each of the plurality of primary coil segments (102, 104, 106, 108) is electrically connected in parallel across a first primary input terminal (128) and a second primary input terminal (130). The step-up toroidal transformer (100) also includes a secondary winding (126) formed from a plurality of turns of a second elongated conductor coiled around the toroidal shaped core (136).

Abstract: Method for fabricating a textured dielectric substrate (400) for an RF circuit. The method can include the step (104) of selecting a plurality of dielectric substrate materials, each having a distinct combination or set of electrical properties that is different from the combination of electrical properties of every other one of dielectric substrate materials. Selecting a textured substrate patter (106) which is comprised of at least two types of distinct areas respectively having the distinct sets of electrical properties, with each distinct area dimensioned much smaller than a wavelength at a frequency of interest. Cutting the dielectric substrate materials (202, 204) into a size and shape consistent with the distinct areas of the selected pattern so as to form a plurality of dielectric pieces (206, 208). Arranging the dielectric pieces on a base plate (302) in accordance with the selected pattern to form the textured dielectric substrate.

Abstract: A toroidal inductor (100) and method of forming same. The invention is intended to decrease the direct current resistance (DCR) of the toroidal inductor circuit. Thus, an increase in the quality factor (Q) of the circuit is produced. The toroidal inductor includes a coil formed from an elongated conductor extending around a core material and defining a plurality of turns. The elongated conductor is comprised of one or more coil segments. The coil segments are arranged in an alternating pattern of a first type segment (101) and a second type segment (102). Each of the coil segments of the first type includes a plurality of elongated parallel conductors (104, 105) spaced apart and electrically connected by conductive links (108) at predetermined intervals along their respective lengths. The coil segments of the second type are formed of a single conductor defined by a conductive via (302, 304) formed in the substrate.

Abstract: Method for fabricating a textured dielectric substrate (400) for an RF circuit. The method can include the step (104) of selecting a plurality of dielectric substrate materials, each having a distinct combination or set of electrical properties that is different from the combination of electrical properties of every other one of dielectric substrate materials. Selecting a textured substrate patter (106) which is comprised of at least two types of distinct areas respectively having the distinct sets of electrical properties, with each distinct area dimensioned much smaller than a wavelength at a frequency of interest. Cutting the dielectric substrate materials (202, 204) into a size and shape consistent with the distinct areas of the selected pattern so as to form a plurality of dielectric pieces (206, 208). Arranging the dielectric pieces on a base plate (302) in accordance with the selected pattern to form the textured dielectric substrate.

Abstract: Method for fabricating a textured dielectric substrate (400) for an RF circuit. The method can include the step (104) of selecting a plurality of dielectric substrate materials, each having a distinct combination or set of electrical properties that is different from the combination of electrical properties of every other one of dielectric substrate materials. Selecting a textured substrate pattern (106) which is comprised of at least two types of distinct areas respectively having the distinct sets of electrical properties, with each distinct area dimensioned much smaller than a wavelength at a frequency of interest. Cutting the dielectric substrate materials (202, 204) into a size and shape consistent with the distinct areas of the selected pattern so as to form a plurality of dielectric pieces (206, 208). Arranging the dielectric pieces on a base plate (302) in accordance with the selected pattern to form the textured dielectric substrate.

Abstract: A toroidal inductor, including a substrate (100), a toroidal core region (434) defined within the substrate, and a toroidal coil including a first plurality of turns formed about the toroidal core region and a second plurality of turns formed about the toroidal core region. The second plurality of turns can define a cross sectional area (440) greater than a cross sectional area (442) defined by the first plurality of turns. The substrate and the toroidal coil can be formed in a co-firing process to form an integral substrate structure with the toroidal coil at least partially embedded therein. The first and second plurality of turns can be disposed in alternating succession. The toroidal core region can be formed of a substrate material having a permeability greater than at least one other portion of the substrate.

Abstract: A toroidal inductor, including a substrate (100), a toroidal core region (434) defined within the substrate, and a toroidal coil including a first plurality of turns formed about the toroidal core region and a second plurality of turns formed about the toroidal core region. The second plurality of turns can define a cross sectional area (440) greater than a cross sectional area (442) defined by the first plurality of turns. The substrate and the toroidal coil can be formed in a co-firing process to form an integral substrate structure with the toroidal coil at least partially embedded therein. The first and second plurality of turns can be disposed in alternating succession. The toroidal core region can be formed of a substrate material having a permeability greater than at least one other portion of the substrate.

Abstract: Embedded check-valve assembly (100, 600) for integration in a micro-fluidic system. The assembly can include a check-valve chamber (104, 604), an inlet port (106, 606) and an outlet port (108, 608) formed from at least one layer of liquid crystal polymer (LCP) film to form a substrate (102, 602). A plug (114, 614) is disposed within the check-valve chamber.

Abstract: Embedded check-valve manufacturing assembly (100, 600) for integration in a micro-fluidic system. The assembly can include a check-valve chamber (104, 604), an inlet port (106, 606) and an outlet port (108, 608) formed from at least one layer of an low-temperature co-fired ceramic (LTCC) tape to form a substrate (102, 602). A fired LTCC plug (114, 614) is disposed within the check-valve chamber.

Abstract: Embedded check-valve manufacturing assembly (100, 600) for subsequent firing and integration in a micro-fluidic system. The assembly can include a check-valve chamber (104, 604), an inlet port (106, 606) and an outlet port (108, 608) formed from at least one layer of an unfired low-temperature co-fired ceramic (LTCC) tape to form a substrate (102, 602). A plug (114, 614) is disposed within the check-valve chamber that is capable of withstanding the LTCC firing process without damage or distortion.

Abstract: Embedded capacitors and a method for manufacturing the embedded capacitors. The method can include the steps of forming at least one bore (115) in a dielectric substrate (100). The dielectric substrate can be mechanically punched or laser cut to form the bore. The bore can be filled with a conductive material (250) to form a first electrode (470). A conductor (360) can be formed on the dielectric substrate, the conductor not being electrically continuous with the first electrode. A depth and/or cross sectional area of the bore can be selected to provide a desired amount of capacitive coupling between the electrode and the conductor. At least a second bore can be formed in the dielectric substrate and filled with a conductive material to form a second electrode. The second electrode can be electrically connected to the first electrode.

Abstract: Method for fabricating a textured dielectric substrate (400) for an RF circuit. The method can include the step (104) of selecting a plurality of dielectric substrate materials, each having a distinct combination or set of electrical properties that is different from the combination of electrical properties of every other one of dielectric substrate materials. Selecting a textured substrate pattern (106) which is comprised of at least two types of distinct areas respectively having the distinct sets of electrical properties, with each distinct area dimensioned much smaller than a wavelength at a frequency of interest. Cutting the dielectric substrate materials (202, 204) into a size and shape consistent with the distinct areas of the selected pattern so as to form a plurality of dielectric pieces (206, 208). Arranging the dielectric pieces on a base plate (302) in accordance with the selected pattern to form the textured dielectric substrate.

Abstract: A rigid substrate board (105) having at least one layer with first (106) and second (107) opposing surfaces. At least one bore is formed in the layer and extending from the first surface (106) to the second surface (107). A resistive material is disposed within the bore and fills the bore to form a resistor (140). Further, a first conductor (115) is disposed on the first surface (106) to form an electrical connection with a first end of the resistor (140), and a second conductor (120) is disposed on the second surface to form an electrical connection with a second end of the resistor. A plurality of resistors (140) can be formed in the substrate layer (105) and interconnected to define a resistive network.

Abstract: The method includes selecting two or more types of ceramic materials (202, 204), each having a distinct set of electrical properties different from the other of the types of ceramic materials. A substrate pattern can also be selected. The substrate pattern can comprise at least two types of distinct substrate areas having the distinct sets of electrical properties of the ceramic materials. Each distinct area can be selected so as to have dimensions much smaller than a wavelength at a frequency of interest. The ceramic materials (202, 204) can thereafter be fired and then cut into a size and shape consistent with the distinct areas to form dielectric pieces (206, 208). The process continues by selectively arranging the dielectric pieces on a base plate (302) in accordance with the pattern to form the textured ceramic dielectric substrate.