Patents by Inventor Terry R. Billger

Terry R. Billger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic module packages and assemblies for electrical systems
    Patent number: 8867231
    Abstract: An electronic module package that includes an electronic module configured to receive input signals and process the input signals to provide output signals. The module package also includes an interposer having a board substrate with opposite mounting and substrate surfaces. The mounting surface has a mounting array of electrical contacts. The substrate surface has a module array of electrical contacts and a component array of electrical contacts. The electronic module is attached to the substrate surface and electrically coupled to the module array. The interposer includes first conductive pathways that electrically couple the module array and the mounting array and also includes second conductive pathways that electrically couple the module array and the component array.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: October 21, 2014
    Assignee: Tyco Electronics Corporation
    Inventors: Lee Jacobo Jose Roitberg, Terry R. Billger
  • ELECTRONIC MODULE PACKAGES AND ASSEMBLIES FOR ELECTRICAL SYSTEMS
    Publication number: 20130182394
    Abstract: An electronic module package that includes an electronic module configured to receive input signals and process the input signals to provide output signals. The module package also includes an interposer having a board substrate with opposite mounting and substrate surfaces. The mounting surface has a mounting array of electrical contacts. The substrate surface has a module array of electrical contacts and a component array of electrical contacts. The electronic module is attached to the substrate surface and electrically coupled to the module array. The interposer includes first conductive pathways that electrically couple the module array and the mounting array and also includes second conductive pathways that electrically couple the module array and the component array.
    Type: Application
    Filed: January 13, 2012
    Publication date: July 18, 2013
    Applicant: Tyco Electronics Corporation
    Inventors: Lee Jacobo Jose Roitberg, Terry R. Billger