Abstract: A sensor for a medical device including a plurality of sensor segments. Each of the plurality of sensor segments can include a layer of magnetically-permeable material and a layer of electrically-conductive material disposed on the layer of magnetically-permeable material. In an example, the layer of magnetically-permeable material can be arranged in a partially-annular shape. The sensor segments can include an electrical connection formation that extends transverse to the layers of magnetically-permeable material and electrically-conductive material. The electrical connection formation can be electrically coupled with the layer of electrically-conductive material. The plurality of sensor segments can be electrically coupled with each other through an electrical coupling of the respective layer of electrically-conductive material of each sensor segment with the electrical connection formation of another sensor segment.

Abstract: The present disclosure relates generally to catheter devices, including irrigated and non-irrigated ablation catheters. More specifically, this disclosure relates to irrigated ablation catheters including an irrigation lumen having at least one electronic device at least partially disposed therein. In many embodiments, the irrigation lumen further includes at least one sideport. In some embodiments, the electronic device has a distal end extending out of the irrigation lumen and into an electrode tip assembly. In some embodiments, a proximal end of the electronic device extends through the sideport in the irrigation lumen.

Abstract: A sensor for a medical device including a plurality of sensor segments. Each of the plurality of sensor segments can include a layer of magnetically-permeable material and a layer of electrically-conductive material disposed on the layer of magnetically-permeable material. In an example, the layer of magnetically-permeable material can be arranged in a partially-annular shape. The sensor segments can include an electrical connection formation that extends transverse to the layers of magnetically-permeable material and electrically-conductive material. The electrical connection formation can be electrically coupled with the layer of electrically-conductive material. The plurality of sensor segments can be electrically coupled with each other through an electrical coupling of the respective layer of electrically-conductive material of each sensor segment with the electrical connection formation of another sensor segment.

Abstract: A sensor for a medical device including a plurality of sensor segments. Each of the plurality of sensor segments can include a layer of magnetically-permeable material and a layer of electrically-conductive material disposed on the layer of magnetically-permeable material. In an example, the layer of magnetically-permeable material can be arranged in a partially-annular shape. The sensor segments can include an electrical connection formation that extends transverse to the layers of magnetically-permeable material and electrically-conductive material. The electrical connection formation can be electrically coupled with the layer of electrically-conductive material. The plurality of sensor segments can be electrically coupled with each other through an electrical coupling of the respective layer of electrically-conductive material of each sensor segment with the electrical connection formation of another sensor segment.

Abstract: A connection device for a deflectable medical device, such as a catheter, comprises an elongate planarity wire having a proximal end and a distal end, an elongate activation wire having a proximal end a distal end, a passage and an interface. The passage extends through the planarity wire near the distal end of the planarity wire. The distal end of the activation wire extends through the passage. The interface is between the passage and the activation wire, and may comprise one or more of the following: a hook and bore interface, a detent interface, a mechanical interface, or a metallurgical interface.

Abstract: The present disclosure relates generally to medical devices, and more specifically to ablation catheters including bond joints formed to have improved strength and resistance to failure during use. In many embodiments an expanded bond-joint length and area and gap filling are used to increase the strength of the bond joint while decreasing relative variability. The bond joint length area is increased in a controlled manner so as to increase the overall strength of the bond joint by shifting the failure mode from the bond joint to a stronger area of the ablation catheter, such as the catheter shaft. Related methods of manufacturing such ablation catheters (or other medical devices including a bond joint) are also disclosed and described herein.

Abstract: A sensor for a medical device including a plurality of sensor segments. Each of the plurality of sensor segments can include a layer of magnetically-permeable material and a layer of electrically-conductive material disposed on the layer of magnetically-permeable material. In an example, the layer of magnetically-permeable material can be arranged in a partially-annular shape. The sensor segments can include an electrical connection formation that extends transverse to the layers of magnetically-permeable material and electrically-conductive material. The electrical connection formation can be electrically coupled with the layer of electrically-conductive material. The plurality of sensor segments can be electrically coupled with each other through an electrical coupling of the respective layer of electrically-conductive material of each sensor segment with the electrical connection formation of another sensor segment.

Abstract: Methods of manufacturing a sensor for a medical de vice may include the application of semiconductor fabrication techniques to the manufacture of a sensor directly in a structure of the medical device or in a substrate that can be integrated into a medical device structure. The methods may be applied to manufacture position sensors, strain gauges, other transducers, and the like, and to integrate the sensors into a variety of medical device types including, but not limited to, elongate medical devices.

Abstract: The present disclosure relates generally to medical devices, and more specifically to ablation catheters including bond joints formed to have improved strength and resistance to failure during use. In many embodiments an expanded bond-joint length and area and gap filling are used to increase the strength of the bond joint while decreasing relative variability. The bond joint length area is increased in a controlled manner so as to increase the overall strength of the bond joint by shifting the failure mode from the bond joint to a stronger area of the ablation catheter, such as the catheter shaft. Related methods of manufacturing such ablation catheters (or other medical devices including a bond joint) are also disclosed and described herein.

Abstract: The present disclosure relates generally to medical devices, and more specifically to ablation catheters including bond joints formed to have improved strength and resistance to failure during use. In many embodiments an expanded bond-joint length and area and gap filling are used to increase the strength of the bond joint while decreasing relative variability. The bond joint length area is increased in a controlled manner so as to increase the overall strength of the bond joint by shifting the failure mode from the bond joint to a stronger area of the ablation catheter, such as the catheter shaft. Related methods of manufacturing such ablation catheters (or other medical devices including a bond joint) are also disclosed and described herein.

Abstract: An elongate medical device handle may comprise a body defining an interior, an exterior, and a connector port extending between the interior and the exterior and defining an axis. The connector port comprises a portion having a polygonal cross-section taken transverse to the axis. In an embodiment, the polygonal cross-section may comprise a star shape. In an embodiment, a connector, such as a fluid connector, may be secured in the connector port using an adhesive.

Abstract: An elongate medical device may include a corewire (188) defining a longitudinal axis, a sensor (176), and a flexible substrate (162) wrapped around the sensor so as to form a tube. The tube is disposed about the longitudinal axis. The elongate body may be a corewire, in an embodiment, and the corewire may extend through the tube. The sensor may comprise a coil, in an embodiment, and the corewire may extend through the coil. The elongate medical device may be a guidewire, in an embodiment.

Abstract: Methods of manufacturing a sensor for a medical de vice may include the application of semiconductor fabrication techniques to the manufacture of a sensor directly in a structure of the medical device or in a substrate that can be integrated into a medical device structure. The methods may be applied to manufacture position sensors, strain gauges, other transducers, and the like, and to integrate the sensors into a variety of medical device types including, but not limited to, elongate medical devices.

Abstract: A connection device for a deflectable medical device, such as a catheter, comprises an elongate planarity wire having a proximal end and a distal end, an elongate activation wire having a proximal end a distal end, a passage and an interface. The passage extends through the planarity wire near the distal end of the planarity wire. The distal end of the activation wire extends through the passage. The interface is between the passage and the activation wire, and may comprise one or more of the following: a hook and bore interface, a detent interface, a mechanical interface, or a metallurgical interface.

Abstract: The present disclosure relates generally to medical devices, and more specifically to ablation catheters including bond joints formed to have improved strength and resistance to failure during use. In many embodiments an expanded bond-joint length and area and gap filling are used to increase the strength of the bond joint while decreasing relative variability. The bond joint length area is increased in a controlled manner so as to increase the overall strength of the bond joint by shifting the failure mode from the bond joint to a stronger area of the ablation catheter, such as the catheter shaft. Related methods of manufacturing such ablation catheters (or other medical devices including a bond joint) are also disclosed and described herein.

Abstract: The present disclosure relates generally to catheter devices, including irrigated and non-irrigated ablation catheters. More specifically, this disclosure relates to irrigated ablation catheters including an irrigation lumen having at least one electronic device at least partially disposed therein. In many embodiments, the irrigation lumen further includes at least one sideport. In some embodiments, the electronic device has a distal end extending out of the irrigation lumen and into an electrode tip assembly. In some embodiments, a proximal end of the electronic device extends through the sideport in the irrigation lumen.

Abstract: A method for connecting electronic components, such as, an integrated circuit die and a package substrate, is described. According to one aspect of the invention, a contact pad protective material is applied on one or more of the contact pads on an integrated circuit die. The underfill material is applied to the surface of the die not covered by the contact pad protective material and the underfill material is partially cured in a curing oven. The contact pad material is removed leaving openings over the respective surface of the contact pad. A one or more contacts on a package substrate is inserted into the openings, electronically connecting the contacts to the contact pads.

Abstract: A method for low temperature bumping is disclosed. A resin capable of being cross-linked by free-radical or cationic polymerization at low temperature is provided. Electrically conductive particles are then added to the resin to form a mixture. The mixture is then activated by heat or exposure to light to polymerize the mixture. In an alternative embodiment, a vinyl ether resin is used, to which electrically conductive particles are added. The mixture is polymerized by exposure to light.

Abstract: Electronic device support and processing methods are described. One embodiment includes a method of processing an electronic device including solder bumps extending therefrom. The method includes providing at least one fluid selected from the group consisting of electrorheological fluids and magnorheological fluids on a support structure. The solder bumps extending from the electronic device are positioned in the fluid. The fluid is activated by applying a field selected from the group consisting of an electric field and a magnetic field to the fluid. The activated fluid mechanically holds the electronic device in place. A surface of the electronic device is polished while the electronic device is held in place by the activated fluid. The fluid is deactivated by removing the applied field from the fluid, and the electronic device is separated from the deactivated fluid. Other embodiments are described and claimed.

Abstract: A method for connecting electronic components, such as, an integrated circuit die and a package substrate, is described. According to one aspect of the invention, a contact pad protective material is applied on one or more of the contact pads on an integrated circuit die. The underfill material is applied to the surface of the die not covered by the contact pad protective material and the underfill material is partially cured in a curing oven. The contact pad material is removed leaving openings over the respective surface of the contact pad. A one or more contacts on a package substrate is inserted into the openings, electronically connecting the contacts to the contact pads.