Patents by Inventor Terry Tarn
Terry Tarn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9261696Abstract: The present invention provides a microstructure device comprising multiple substrates with the components of the device formed on the substrates. In order to maintain uniformity of the gap between the substrates, a plurality of pillars is provided and distributed in the gap so as to prevent decrease of the gap size. The increase of the gap size can be prevented by bonding the pillars to the components of the microstructure. Alternatively, the increase of the gap size can be prevented by maintaining the pressure inside the gap below the pressure under which the microstructure will be in operation. Electrical contact of the substrates on which the micromirrors and electrodes are formed can be made through many ways, such as electrical contact areas, electrical contact pads and electrical contact springs.Type: GrantFiled: April 8, 2014Date of Patent: February 16, 2016Assignee: TEXAS INSTURMENTS INCORPORATEDInventors: Satyadev Patel, Andrew G. Huibers, Peter Richards, Terry Tarn, Dietrich Dehlinger
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Patent number: 9056764Abstract: A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between which a microelectromechanical device, such as a micromirror array device is located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer is deposited, and heated by the heater so as to bond the first and second package substrates together.Type: GrantFiled: October 16, 2007Date of Patent: June 16, 2015Assignee: TEXAS INSTRUMENTS INCORPORATEDInventor: Terry Tarn
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Publication number: 20140299653Abstract: The present invention provides a microstructure device comprising multiple substrates with the components of the device formed on the substrates. In order to maintain uniformity of the gap between the substrates, a plurality of pillars is provided and distributed in the gap so as to prevent decrease of the gap size. The increase of the gap size can be prevented by bonding the pillars to the components of the microstructure. Alternatively, the increase of the gap size can be prevented by maintaining the pressure inside the gap below the pressure under which the microstructure will be in operation. Electrical contact of the substrates on which the micromirrors and electrodes are formed can be made through many ways, such as electrical contact areas, electrical contact pads and electrical contact springs.Type: ApplicationFiled: April 8, 2014Publication date: October 9, 2014Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Satyadev Patel, Andrew G. Huibers, Peter Richards, Terry Tarn, Dietrich Dehlinger
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Patent number: 8778741Abstract: Disclosed herein is a device package that comprises a device having a top substrate that is disposed on a supporting surface of a package substrate. A package frame contacts the top surface of the top substrate and top surface of the package substrate, and hermetically seals the device between the top surfaces of the top substrate and package substrate. The device can be a semiconductor device, a microstructure such as a microelectromechanical device, or other devices.Type: GrantFiled: December 19, 2008Date of Patent: July 15, 2014Assignee: Texas Instruments IncorporatedInventors: Robert M. Duboc, Terry Tarn
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Patent number: 8693082Abstract: The present invention provides a microstructure device comprising multiple substrates with the components of the device formed on the substrates. In order to maintain uniformity of the gap between the substrates, a plurality of pillars is provided and distributed in the gap so as to prevent decrease of the gap size. The increase of the gap size can be prevented by bonding the pillars to the components of the microstructure. Alternatively, the increase of the gap size can be prevented by maintaining the pressure inside the gap below the pressure under which the microstructure will be in operation. Electrical contact of the substrates on which the micromirrors and electrodes are formed can be made through many ways, such as electrical contact areas, electrical contact pads and electrical contact springs.Type: GrantFiled: August 10, 2010Date of Patent: April 8, 2014Assignee: Texas Instruments IncorporatedInventors: Satyadev Patel, Andrew G. Huibers, Peter Richards, Terry Tarn, Dietrich Dehlinger
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Publication number: 20120180949Abstract: A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between which a microelectromechanical device, such as a micromirror array device is located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer is deposited, and heated by the heater so as to bond the first and second package substrates together.Type: ApplicationFiled: October 16, 2007Publication date: July 19, 2012Applicant: TEXAS INSTRUMENTS INCORPORATEDInventor: Terry Tarn
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Patent number: 7872338Abstract: A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between which a microelectromechanical device, such as a micromirror array device is located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer is deposited, and heated by the heater so as to bond the first and second package substrates together.Type: GrantFiled: November 7, 2008Date of Patent: January 18, 2011Assignee: Texas Instruments IncorporatedInventor: Terry Tarn
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Publication number: 20100302618Abstract: The present invention provides a microstructure device comprising multiple substrates with the components of the device formed on the substrates. In order to maintain uniformity of the gap between the substrates, a plurality of pillars is provided and distributed in the gap so as to prevent decrease of the gap size. The increase of the gap size can be prevented by bonding the pillars to the components of the microstructure. Alternatively, the increase of the gap size can be prevented by maintaining the pressure inside the gap below the pressure under which the microstructure will be in operation. Electrical contact of the substrates on which the micromirrors and electrodes are formed can be made through many ways, such as electrical contact areas, electrical contact pads and electrical contact springs.Type: ApplicationFiled: August 10, 2010Publication date: December 2, 2010Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Satyadev Patel, Andrew G. Huibers, Peter Richards, Terry Tarn, Dietrich Dehlinger
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Patent number: 7787170Abstract: The present invention provides a microstructure device comprising multiple substrates with the components of the device formed on the substrates. In order to maintain uniformity of the gap between the substrates, a plurality of pillars is provided and distributed in the gap so as to prevent decrease of the gap size. The increase of the gap size can be prevented by bonding the pillars to the components of the microstructure. Alternatively, the increase of the gap size can be prevented by maintaining the pressure inside the gap below the pressure under which the microstructure will be in operation. Electrical contact of the substrates on which the micromirrors and electrodes are formed can be made through many ways, such as electrical contact areas, electrical contact pads and electrical contact springs.Type: GrantFiled: June 15, 2004Date of Patent: August 31, 2010Assignee: Texas Instruments IncorporatedInventors: Satyadev Patel, Andrew G. Huibers, Peter Richards, Terry Tarn, Dietrich Dehlinger
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Publication number: 20090098685Abstract: Disclosed herein is a device package that comprises a device having a top substrate that is disposed on a supporting surface of a package substrate. A package frame contacts the top surface of the top substrate and top surface of the package substrate, and hermetically seals the device between the top surfaces of the top substrate and package substrate. The device can be a semiconductor device, a microstructure such as a microelectromechanical device, or other devices.Type: ApplicationFiled: December 19, 2008Publication date: April 16, 2009Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Robert M. Duboc, Terry Tarn
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Patent number: 7508063Abstract: Disclosed herein is a device package that comprises a device having a top substrate that is disposed on a supporting surface of a package substrate. A package frame contacts the top surface of the top substrate and top surface of the package substrate, and hermetically seals the device between the top surfaces of the top substrate and package substrate. The device can be a semiconductor device, a microstructure such as a microelectromechanical device, or other devices.Type: GrantFiled: April 5, 2005Date of Patent: March 24, 2009Assignee: Texas Instruments IncorporatedInventors: Robert M. Duboc, Terry Tarn
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Publication number: 20090072380Abstract: A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between which a microelectromechanical device, such as a micromirror array device is located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer is deposited, and heated by the heater so as to bond the first and second package substrates together.Type: ApplicationFiled: November 7, 2008Publication date: March 19, 2009Applicant: Texas Instruments IncorporatedInventor: Terry Tarn
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Patent number: 7449773Abstract: A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between which a microelectromechanical device, such as a micromirror array device is located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer is deposited, and heated by the heater so as to bond the first and second package substrates together.Type: GrantFiled: January 25, 2005Date of Patent: November 11, 2008Assignee: Texas Instruments IncorporatedInventor: Terry Tarn
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Patent number: 7408250Abstract: A microstructure is packaged with a device substrate of the microstructure being attached to a package substrate. For dissipating possible deformation of the microstructure, which may result in device failure or quality degradation of the microstructure, an adhesive material comprising a compliant adhesive component is applied and positioned between the device substrate and package substrate.Type: GrantFiled: April 5, 2005Date of Patent: August 5, 2008Assignee: Texas Instruments IncorporatedInventors: Jonathan Doan, Terry Tarn
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Patent number: 7402878Abstract: A novel method of packaging electronic devices (e.g. any device that receives or transmits electronic signals) including microelectromechanical devices, semiconductor devices, light emitting devices, light modulating devices, light modulating devices, and light detecting device has been provided herein. The electronic device is placed between two substrates, at least one of which has a cavity for holding the electronic device. The two substrates are then bonded and hermetically sealed with a sealing medium. The adhesion of the sealing medium to the substrates, especially when one of the two substrates is ceramic, can be improved by applying a metallization layer to the surface of the substrate.Type: GrantFiled: May 24, 2004Date of Patent: July 22, 2008Assignee: Texas Instruments IncorporatedInventor: Terry Tarn
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Patent number: 7282393Abstract: A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between which a microelectromechanical device, such as a micromirror array device is located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer is deposited, and heated by the heater so as to bond the first and second package substrates together.Type: GrantFiled: January 25, 2005Date of Patent: October 16, 2007Assignee: Texas Instruments IncorporatedInventor: Terry Tarn
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Patent number: 7164199Abstract: A microelectromechanical device package and a low-stress inducing method for packaging a microelectromechanical device are disclosed in this invention. The microelectromechanical device is accommodated within a cavity comprised by a first package substrate and a second substrate, wherein a third substrate is disposed between and bonded to both the microelectromechanical device lower semiconductor substrate and the package bottom substrate. The first and second package substrates are then bonded so as to package the microelectromechanical device inside.Type: GrantFiled: September 28, 2005Date of Patent: January 16, 2007Assignee: Texas Instruments IncorporatedInventor: Terry Tarn
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Publication number: 20060220045Abstract: A microstructure is packaged with a device substrate of the microstructure being attached to a package substrate. For dissipating possible deformation of the microstructure, which may result in device failure or quality degradation of the microstructure, an adhesive material comprising a compliant adhesive component is applied and positioned between the device substrate and package substrate.Type: ApplicationFiled: April 5, 2005Publication date: October 5, 2006Inventors: Jonathan Doan, Terry Tarn
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Publication number: 20060220199Abstract: Disclosed herein is a device package that comprises a device having a top substrate that is disposed on a supporting surface of a package substrate. A package frame contacts the top surface of the top substrate and top surface of the package substrate, and hermetically seals the device between the top surfaces of the top substrate and package substrate. The device can be a semiconductor device, a microstructure such as a microelectromechanical device, or other devices.Type: ApplicationFiled: April 5, 2005Publication date: October 5, 2006Inventors: Robert Duboc, Terry Tarn
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Patent number: 7110160Abstract: Disclosed herein a microelectromechanical device having first and second substrates that are bonded together with a gap formed therebetween. A plurality of functional members is disposed within the gap. The two substrates are bonded with a bonding agent that comprises an electrically conductive adhesive material.Type: GrantFiled: April 8, 2005Date of Patent: September 19, 2006Assignee: Reflectivity, INCInventors: Satyadev Patel, Peter Richards, Jonathan Doan, Terry Tarn