Patents by Inventor Terry Tong

Terry Tong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR COMBINED THROUGH-HOLE PLATING AND VIA FILLING
    Publication number: 20150289387
    Abstract: The present invention relates to a method for copper electroplating in the manufacture of printed circuit boards, IC substrates and the like. Said method is suitable for a combined conformal through-hole filling and filling of blind micro vias. The method utilizes a metal redox system and pulse reverse plating.
    Type: Application
    Filed: November 27, 2012
    Publication date: October 8, 2015
    Inventors: Marko Mirkovic, Marcin Klobus, Terry Tong, Ted Chen, Tiger Tang, Christoph Moser