Abstract: A packaging assembly for magnetic bubble chips comprising at least one module assembly board having a surface to which is secured in a substantially planar array a plurality of magnetic bubble chips for the storing and processing of information. First and second sets of terminals are located on opposed lateral edges of the module assembly board for the routing therethrough of information to and from the chips. First and second mounting boards are provided, each board having a set of receptacles for the soldering thereto of a corresponding set of the terminals. A first coil surrounds the module assembly board and is wound about an axis parallel to that of the plane of the chips for producing a magnetic field parallel thereto. A second coil surrounds the first coil and is wound about an axis perpendicular to that of the first coil and parallel to that of the plane of the chips for producing a magnetic field parallel thereto.

Abstract: A dual-in-line plastic package for an integrated circuit is assembled with the use of a thermal stress-resistant thin-film interconnect pattern on a flexible insulator film. All electrical connections to the semiconductor chip are made simultaneously by bonding directly to the thin-film interconnect pattern. Each segment of the interconnect pattern is then connected simultaneously to a simplified external lead frame, by means of a novel soldering technique. The assembly is then ready for plastic encapsulation and final trimming. By supplying both the flexible interconnect pattern and the external lead frame in continuous coils or reels, a high degree of handling simplicity, speed and accuracy is achieved with a maximum opportunity for automation, to produce a low work content product.

Abstract: A dual-in-line plastic package for an integrated circuit is assembled with the use of a thermal stress-resistant thin-film interconnect pattern on a flexible insulator film. All electrical connections to the semiconductor chip are made simultaneously by bonding directly to the thin-film interconnect pattern. Each segment of the interconnect pattern is then connected simultaneously to a simplified external lead frame, by means of a novel soldering technique. The assembly is then ready for plastic encapsulation and final trimming. By supplying both the flexible interconnect pattern and the external lead frame in continuous coils or reels, a high degree of handling simplicity, speed and accuracy is achieved with a maximum opportunity for automation, to produce a low work content product.