Patents by Inventor Teru Hirata

Teru Hirata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making resin encapsulated semiconductor device with bump electrodes
    Patent number: 5766972
    Abstract: A semiconductor device includes a semiconductor chip attached to a lead frame with recesses on the rear surface of the semiconductor chip opposite the lead frame. These recesses increase the heat radiation area of the semiconductor chip. In a method of producing a semiconductor device, the height of a cavity between upper and lower dies is smaller than the height of the semiconductor chip including bump electrodes. During a molding process, the bump electrodes contact the upper die or a dam surrounding the bump electrodes so that no thin burrs are produced on the surfaces of the bump electrodes in the molding process.
    Type: Grant
    Filed: May 17, 1995
    Date of Patent: June 16, 1998
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoshiharu Takahashi, Jiro Oseto, Teru Hirata
  • IC card including a substrate having improved strength and heat radiation properties
    Patent number: 5521433
    Abstract: An IC card includes a substrate having a metal fiber resin material layer made of a mixture of a resin and metal fibers and a conductive pattern. The conductive pattern and the metal fiber resin material layer are electrically insulated from each other by a resist film. Heat radiation and mechanical strength of the IC card are enhanced.
    Type: Grant
    Filed: March 22, 1995
    Date of Patent: May 28, 1996
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Teru Hirata, Shigeo Onoda, Tetsuro Washida, Yasuhiro Murasawa