Patents by Inventor Teruaki Kasai
Teruaki Kasai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11228159Abstract: A semiconductor laser device includes first heat radiator (10) having first flow path (11) and second flow path (12) inside to allow a flow of a refrigerant and second heat radiator (20) put in contact with an upper surface of the first heat radiator. The first flow path and the second flow path are independent of each other. The second heat radiator includes an insulating member that internally has third flow path (23) communicating with first flow path (11). The semiconductor laser device further includes lower electrode block (60) disposed on a portion of an upper surface of the second heat radiator, submount (30) being made of a conductive material and being disposed on a remainder of the upper surface of second heat radiator (20), semiconductor laser element (40) disposed on an upper surface of submount (30), and upper electrode block (61) disposed such that submount (30) and semiconductor laser element (40) are clamped between the upper electrode block and second heat radiator (20).Type: GrantFiled: December 24, 2019Date of Patent: January 18, 2022Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Kouji Oomori, Kouki Tsumura, Teruaki Kasai
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Patent number: 11133644Abstract: Semiconductor laser device (1) includes lower electrode block (10) that has a first terminal hole and first and second connection holes, upper electrode block (60) that has third connection holes communicating with the respective first connection holes and a second terminal hole, heat sink (110) that has fourth connection holes communicating with the respective second connection holes, and optical component (100) attached to upper electrode block (60). The first and the second connection holes are formed on both side of a recess that is formed to house a submount on which a semiconductor laser element is disposed. Lower electrode block (10) is disposed on heat sink (110). Lower electrode block (10) and upper electrode block (60) are fastened together with first fasteners (90, 90), whereas lower electrode block (10) and heat sink (110) are fastened together with second fasteners (91, 91).Type: GrantFiled: December 24, 2019Date of Patent: September 28, 2021Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Kouji Oomori, Teruaki Kasai
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Publication number: 20200136344Abstract: A semiconductor laser device includes first heat radiator (10) having first flow path (11) and second flow path (12) inside to allow a flow of a refrigerant and second heat radiator (20) put in contact with an upper surface of the first heat radiator. The first flow path and the second flow path are independent of each other. The second heat radiator includes an insulating member that internally has third flow path (23) communicating with first flow path (11). The semiconductor laser device further includes lower electrode block (60) disposed on a portion of an upper surface of the second heat radiator, submount (30) being made of a conductive material and being disposed on a remainder of the upper surface of second heat radiator (20), semiconductor laser element (40) disposed on an upper surface of submount (30), and upper electrode block (61) disposed such that submount (30) and semiconductor laser element (40) are clamped between the upper electrode block and second heat radiator (20).Type: ApplicationFiled: December 24, 2019Publication date: April 30, 2020Inventors: KOUJI OOMORI, KOUKI TSUMURA, TERUAKI KASAI
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Publication number: 20200136343Abstract: Semiconductor laser device (1) includes lower electrode block (10) that has a first terminal hole and first and second connection holes, upper electrode block (60) that has third connection holes communicating with the respective first connection holes and a second terminal hole, heat sink (110) that has fourth connection holes communicating with the respective second connection holes, and optical component (100) attached to upper electrode block (60). The first and the second connection holes are formed on both side of a recess that is formed to house a submount on which a semiconductor laser element is disposed. Lower electrode block (10) is disposed on heat sink (110). Lower electrode block (10) and upper electrode block (60) are fastened together with first fasteners (90, 90), whereas lower electrode block (10) and heat sink (110) are fastened together with second fasteners (91, 91).Type: ApplicationFiled: December 24, 2019Publication date: April 30, 2020Inventors: KOUJI OOMORI, TERUAKI KASAI
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Patent number: 8897328Abstract: The semiconductor laser device of the present invention has a conductive first heatsink member, a conductive first adhesive, and a semiconductor laser element. The first adhesive is disposed on the first heatsink member, and the semiconductor laser element is disposed on the first adhesive. The first adhesive reaches an upper part of the side surface of the first heatsink member under the laser emission surface for laser emission of the semiconductor laser element. The structure further improves heat dissipation of the semiconductor laser element; at the same time, it is effective in obtaining laser light from the semiconductor laser element.Type: GrantFiled: April 1, 2014Date of Patent: November 25, 2014Assignee: Panasonic CorporationInventors: Takayuki Yoshida, Naoto Ueda, Kouji Oomori, Takuma Motofuji, Teruaki Kasai
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Publication number: 20140211819Abstract: The semiconductor laser device of the present invention has a conductive first heatsink member, a conductive first adhesive, and a semiconductor laser element. The first adhesive is disposed on the first heatsink member, and the semiconductor laser element is disposed on the first adhesive. The first adhesive reaches an upper part of the side surface of the first heatsink member under the laser emission surface for laser emission of the semiconductor laser element. The structure further improves heat dissipation of the semiconductor laser element; at the same time, it is effective in obtaining laser light from the semiconductor laser element.Type: ApplicationFiled: April 1, 2014Publication date: July 31, 2014Applicant: Panasonic CorporationInventors: Takayuki Yoshida, Naoto Ueda, Kouji Oomori, Takuma Motofuji, Teruaki Kasai
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Patent number: 8614118Abstract: Provided is a component bonding method of bonding a semiconductor component having a thermosetting adhesive layer formed on a lower surface thereof to a circuit board having a resin layer formed on a surface thereof. In the method, wettability is improved by surface modification that performs a plasma treatment on a resin surface of the circuit board, the semiconductor component is held by a component holding nozzle having a heater, the adhesive layer is contacted to the surface-modified resin layer, and the adhesive layer is heated and thermally cured by the heater. Thereby, adhesion between the adhesive layer and the resin surface is improved, and thus the component holding nozzle can be separated from the semiconductor component without wait for completely hardening the adhesive layer. Accordingly, it is possible to improve productivity in the heat pressing process by reducing the time required for the component bonding.Type: GrantFiled: February 9, 2007Date of Patent: December 24, 2013Assignee: Panasonic CorporationInventors: Hiroshi Haji, Mitsuru Ozono, Teruaki Kasai, Masaru Nonomura
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Patent number: 8192578Abstract: In the pickup apparatus wherein a chip adhered on a sheet is sucked and held by a picking nozzle and then picked up by the nozzle, a sheet push-up member configured by forming flexible elastic material such as rubber in a spherical shape is attached on the abutment supporting surface of the upper surface of a tool, then the push-up surface of the sheet push-up member is followed in a flat surface state along the lower surface of the sheet and abutted thereto in the moving down state of the picking nozzle, and then the push-up surface pushes up the lower surface of the sheet while being deformed in a upwardly protruded curved surface shape in the moving up operation where the picking nozzle moves up together with the chip. Thus, the chip can be released from the sheet from the outer peripheral side of the chip.Type: GrantFiled: October 13, 2006Date of Patent: June 5, 2012Assignee: Panasonic CorporationInventors: Hiroshi Haji, Mitsuru Ozono, Teruaki Kasai, Kazuhiro Noda
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Patent number: 7632374Abstract: In an adhesive sheet exfoliation process in a pick-up operation for a thin-type chip 6 adhered to the adhesive sheet 5, a suction exfoliation tool 22 provided at its adhesion surface 22a with plural suction grooves 22b is abutted against the lower surface of the adhesive sheet 5. Then, air within the suction grooves 22b are vacuum-sucked to bend and deform the adhesive sheet 5 together with the chip 6 thereby to exfoliate the adhesive sheet 5 from the lower surface of the chip 6 due to such bending deformation. Thus, it is possible to realize the picking-up operation with high productivity without causing a problem such as breakage or crack.Type: GrantFiled: July 15, 2003Date of Patent: December 15, 2009Assignee: Panasonic CorporationInventors: Mitsuru Ozono, Teruaki Kasai
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Publication number: 20090279995Abstract: An object of the invention is to provide a chip pickup apparatus, a chip pickup method, a chip releasing device and a chip releasing method in each of which chips can be picked up at a high speed without being damaged. In the pickup apparatus wherein a chip 6 adhered on a sheet 5 is sucked and held by a picking nozzle 20 and then picked up by the nozzle, a sheet push-up member 24 configured by forming flexible elastic material such as rubber in a spherical shape is attached on the abutment supporting surface of the upper surface of a tool 20, then the push-up surface of the sheet push-up member 24 is followed in a flat surface state along the lower surface of the sheet 5 and abutted thereto in the moving down state of the picking nozzle 20, and then the push-up surface pushes up the lower surface of the sheet 5 while being deformed in a upwardly protruded curved surface shape in the moving up operation where the picking nozzle 20 moves up together with the chip 6.Type: ApplicationFiled: October 13, 2006Publication date: November 12, 2009Applicant: PANASONIC CORPORATIONInventors: Hiroshi Haji, Mitsuru Ozono, Teruaki Kasai, Kazuhiro Noda
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Publication number: 20090202333Abstract: This invention intends to provide an electronic component pick-up method, an electronic component loading method and an electronic component loading apparatus which are capable of executing a pick-up operation of an electronic component adhesively held on a carrier stably and with high productivity. In an electronic component pick-up method for picking up a chip 6 adhesively held by an adhesive layer 5a on a sheet 5, as the adhesive layer 5a, an adhesive containing a compound generating a nitrogen gas by application of ultraviolet rays is employed.Type: ApplicationFiled: October 4, 2005Publication date: August 13, 2009Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Mitsuru Ozono, Hiroshi Haji, Teruaki Kasai
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Publication number: 20090035892Abstract: It is an object of the invention to provide a component bonding method and a component laminating method that can improve productivity in the heat pressing process. Provided is a component bonding method of bonding a semiconductor component (13) having a thermosetting adhesive layer (13a) formed on a lower surface thereof to a circuit board (5) having a resin layer formed on a surface thereof. In the method, wettability is improved by surface modification that performs a plasma treatment on a resin surface (5a) of the circuit board (5), the semiconductor component (13) is held by a component holding nozzle (12) having a heater, the adhesive layer (13c) is contacted to the surface-modified resin layer, and the adhesive layer (13c) is heated and thermally cured by the heater.Type: ApplicationFiled: February 9, 2007Publication date: February 5, 2009Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO. LTD.Inventors: Hiroshi Haji, Mitsuru Ozono, Teruaki Kasai, Masaru Nonomura
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Publication number: 20090000109Abstract: To provide an electronic component pickup method, an electronic component mounting method and an electronic component mounting device capable of stably picking up, with high productivity, an electronic component adhered and held to a carrier. An electronic component pickup method for picking up a chip 6 adhered and held to a sheet 5 with an adhesive layer 5a by way of a support tool 20 uses an adhesive containing a compound that generates a gas by radiation of light. In the pickup operation, the support tool 20 is brought into contact with the top surface of the chip 6 and a light radiating part 8 is positioned below the chip 6. Then ultraviolet light is radiated from the bottom surface of the sheet 5 onto the adhesive layer 5a positioned on the rear surface of the chip 6. When a nitrogen gas generated from the adhesive layer 5a has formed a gas layer G at the adhesive interface between the rear surface of the chip 6 and the adhesive layer 5a, the support tool 20 is lifted to pick up the chip 6.Type: ApplicationFiled: October 4, 2005Publication date: January 1, 2009Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Mitsuru Ozono, Hiroshi Haji, Teruaki Kasai
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Patent number: 7306695Abstract: A semiconductor chip pick-up apparatus includes: a pick-up head for picking up the chip on a sheet; a holding table for holding the sheet; a recognition means for recognizing the chip; a positioning means for positioning the chip relatively to the pick-up head on the basis of the recognition result by the recognition means; and a sheet separating mechanism for separating the sheet from the chip by sucking the sheet from a suction plane brought in contact with a lower surface of the sheet.Type: GrantFiled: April 8, 2004Date of Patent: December 11, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventor: Teruaki Kasai
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Publication number: 20040238117Abstract: A semiconductor chip pick-up apparatus includes: a pick-up head for picking up the chip on a sheet; a holding table for holding the sheet; a recognition means for recognizing the chip; a positioning means for positioning the chip relatively to the pick-up head on the basis of the recognition result by the recognition means; and a sheet separating mechanism for separating the sheet from the chip by sucking the sheet from a suction plane brought in contact with a lower surface of the sheet.Type: ApplicationFiled: April 8, 2004Publication date: December 2, 2004Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventor: Teruaki Kasai
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Publication number: 20040038498Abstract: In an adhesive sheet exfoliation process in a pick-up operation for a thin-type chip 6 adhered to the adhesive sheet 5, a suction exfoliation tool 22 provided at its adhesion surface 22a with plural suction grooves 22b is abutted against the lower surface of the adhesive sheet 5. Then, air within the suction grooves 22b are vacuum-sucked to bend and deform the adhesive sheet 5 together with the chip 6 thereby to exfoliate the adhesive sheet 5 from the lower surface of the chip 6 due to such bending deformation. Thus, it is possible to realize the picking-up operation with high productivity without causing a problem such as breakage or crack.Type: ApplicationFiled: July 15, 2003Publication date: February 26, 2004Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Mitsuru Ozono, Teruaki Kasai
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Patent number: 6390351Abstract: A conductive ball transferring apparatus including: an arranging member having in its top face a plurality of recesses in a predetermined arrangement pattern each capable of receiving one conductive ball therein; a tilting mechanism for tilting the arranging member with respect to a horizontal plane; a speed controller for controlling the moving speeds of the conductive balls that move along the top face of the tilted arranging member in a direction the arranging member has been tilted; and a transferring head for picking up the conductive balls arranged by the arranging member and transferring them onto predetermined positions. With this structure, the moving speeds of the conductive balls are stabilized and the conductive balls are arranged into the recesses quickly without fail, and thereby the transferring head can pick up these conductive balls onto predetermined positions promptly.Type: GrantFiled: October 20, 2000Date of Patent: May 21, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Teruaki Kasai, Shinji Sasaguri, Kenichi Takakura, Tadahiko Sakai, Kazuo Arikado
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Patent number: 6237219Abstract: In a mounting apparatus for mounting conductive ball where a conductive ball 2 is picked up by vacuum to a suction hole 31a formed in the bottom of a suction head 31 for mounting on a workpiece, a reference wave form that represents the amount of light detected at a light detector 43b when a suction head 31 is sucking a conductive ball 2 rightly in the normal state is compared with a wave form detected at the light detector 43b when actually mounting the conductive ball; also a reference wave form detected at the light detector 43b when there is no conductive ball 2 at all on the suction head 31 is compared with a wave form detected at the light detector 43b after mounting of the conductive ball is finished. Through the above described processing, errors in the light interruption that stem from a tilted suction head 31 and machining errors during processing of suction holes 31 are eliminated, and the existence, or non-existence, of the conductive ball 2 is detected at a high accuracy level.Type: GrantFiled: March 5, 1999Date of Patent: May 29, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuo Arikado, Teruaki Kasai, Shinji Sasaguri, Norifumi Eguchi
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Patent number: 5601229Abstract: In a solder ball attaching apparatus, a pickup head is lowered and raised just above a solder ball feed section so as to pick up a large number of solder balls. The pickup head then moves to a position just above a flux feed section where the pickup head is lowered and raised so as to flux the solder balls. Further, the pickup head moves to a position just above a workpiece where the pickup head is lowered and raised so as to attach the solder balls onto electrodes of the workpiece. Alongside a transfer path of the pickup head are arranged first and second line light sources, a light-emitting element and a light-receiving element for monitoring presence or absence of a solder ball pickup error, dislodging of the solder ball and a solder ball attaching error.Type: GrantFiled: November 27, 1995Date of Patent: February 11, 1997Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Siniti Nakazato, Teruaki Kasai
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Patent number: 4385529Abstract: A foot-operated parking brake lever assembly wherein a double-manual operation is required to effect release of the parking brake. The assembly is provided with a pawl having a first pawl section and a second pawl section. The first pawl section is pivotally mounted on a brake lever which is in turn pivotally mounted on a stationary support formed with a series of ratchet teeth. The first pawl section is formed with a finger for selectively engaging the ratchet teeth and thereby retaining the brake lever in brake setting positions thereof. The second pawl section is mounted on the first pawl section for limited rotational movement therewith.Type: GrantFiled: September 22, 1980Date of Patent: May 31, 1983Assignees: Nissan Motor Co., Ltd., Otsuka Koki Co., Ltd.Inventors: Takeshi Ejiri, Seiichi Tanaka, Teruaki Kasai, Masao Komatsuzaki, Satoru Masuda