Patents by Inventor Teruaki Nishioka
Teruaki Nishioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090061737Abstract: A lap platen has a lapping surface contacting a surface of a work piece. A lap base has a support surface brought into contact with and supported by the lapping surface. An adapter has a first support part, a second support part and an arm part. The first support part is supported by the lap base. The work piece is attached to the second support part so that a surface of the work piece to be processed contacts the lapping surface. The arm part extends between the first and second support parts. A height adjusting mechanism adjusts a height from the lapping surface to the first support part. An inclination detector is provided to the adapter to detect an inclination of the adapter. The inclination of the adapter relative to the lapping surface is adjusted by adjusting the height of the first support part by the height adjusting mechanism.Type: ApplicationFiled: June 18, 2008Publication date: March 5, 2009Applicant: FUJITSU LIMITEDInventors: Koji Sudo, Yoshiaki Yanagida, Teruaki Nishioka
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Publication number: 20080182484Abstract: A lapping apparatus includes a lapping plate having a lapping surface thereon that moves relative to a work. The lapping apparatus can adjust an inclination of the work in a latitudinal direction, thereby obtained preferable parallelization of both a reading elements and writing element to the lapping surface. As a result, the lapping apparatus can provide magnetic heads suitable for the perpendicular recording.Type: ApplicationFiled: January 28, 2008Publication date: July 31, 2008Applicant: FUJITSU LIMITEDInventors: Koji Sudo, Yoshiaki Yanagida, Teruaki Nishioka
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Patent number: 7014532Abstract: A lapping machine comprises a lapping surface plate (1) rotated by a rotating mechanism, a lapping jig (28) having a plurality of projections to bottom surfaces of which a work (30) to be lapped by a lapping surface on the lapping surface plate (1) is fitted, amount-of-projection adjusting elements (29) for adjusting the variation of the plurality of projections (28c) to the lapping surface plate (1) individually, and a control circuit (36) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements (29).Type: GrantFiled: April 13, 2004Date of Patent: March 21, 2006Assignee: Fujitsu LimitedInventors: Teruaki Nishioka, Kazuo Yokoi, Yoshiaki Yanagida, Shunsuke Sone
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Patent number: 6913509Abstract: Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.Type: GrantFiled: June 12, 2003Date of Patent: July 5, 2005Assignee: Fujitsu LimitedInventors: Shunsuke Sone, Yoshiaki Yanagida, Teruaki Nishioka, Koji Suto
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Publication number: 20040209546Abstract: A lapping machine comprises a lapping surface plate (1) rotated by a rotating mechanism, a lapping jig (28) having a plurality of projections to bottom surfaces of which a work (30) to be lapped by a lapping surface on the lapping surface plate (1) is fitted, amount-of-projection adjusting elements (29) for adjusting the variation of the plurality of projections (28c) to the lapping surface plate (1) individually, and a control circuit (36) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements (29).Type: ApplicationFiled: April 13, 2004Publication date: October 21, 2004Applicant: Fujitsu LimitedInventors: Teruaki Nishioka, Kazuo Yokoi, Yoshiaki Yanagida, Shunsuke Sone
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Patent number: 6722947Abstract: A lapping machine comprises a lapping surface plate (1) rotated by a rotating mechanism, a lapping jig (28) having a plurality of projections to bottom surfaces of which a work (30) to be lapped by a lapping surface on the lapping surface plate (1) is fitted, amount-of-projection adjusting elements (29) for adjusting the variation of the plurality of projections (28c) to the lapping surface plate (1) individually, and a control circuit (36) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements (29).Type: GrantFiled: September 10, 2001Date of Patent: April 20, 2004Assignee: Fujitsu LimitedInventors: Teruaki Nishioka, Kazuo Yokoi, Yoshiaki Yanagida, Shunsuke Sone, Koji Sudo, Tomokazu Sugiyama
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Publication number: 20030216106Abstract: Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.Type: ApplicationFiled: June 12, 2003Publication date: November 20, 2003Applicant: Fujitsu LimitedInventors: Shunsuke Sone, Yoshiaki Yanagida, Teruaki Nishioka, Koji Suto
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Patent number: 6599170Abstract: Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.Type: GrantFiled: December 13, 2000Date of Patent: July 29, 2003Assignee: Fujitsu LimitedInventors: Shunsuke Sone, Yoshiaki Yanagida, Teruaki Nishioka, Koji Suto, Tomokazu Sugiyama
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Publication number: 20020052172Abstract: A lapping machine comprises a lapping surface plate (1) rotated by a rotating mechanism, a lapping jig (28) having a plurality of projections to bottom surfaces of which a work (30) to be lapped by a lapping surface on the lapping surface plate (1) is fitted, amount-of-projection adjusting elements (29) for adjusting the variation of the plurality of projections (28c) to the lapping surface plate (1) individually, and a control circuit (36) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements (29).Type: ApplicationFiled: September 10, 2001Publication date: May 2, 2002Applicant: FUJITSU LIMITEDInventors: Teruaki Nishioka, Kazuo Yokoi, Yoshiaki Yanagida, Shunsuke Sone, Koji Sudo, Tomokazu Sugiyama
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Patent number: 6315636Abstract: Disclosed herein is a lapping machine for lapping a row bar having a plurality of head sliders. The lapping machine includes a lap plate for providing a lapping surface, a row tool having a work surface for pressing the row bar against the lapping surface, and a mechanism for operating the row tool so that a given pressure distribution is produced between the row bar and the lapping surface. The row tool has a plurality of holes arranged along the work surface. The mechanism includes a plurality of pivoted links each having a load point where a force having a direction perpendicular to the work surface is applied to the row tool in each of the holes. Each of the pivoted links further has a support point as the fulcrum and an effort point where a force having a direction substantially parallel to the work surface is received. The ratio of a distance between the load point and the support point to a distance between the effort point and the support point is substantially constant.Type: GrantFiled: January 18, 2000Date of Patent: November 13, 2001Assignee: Fujitsu LimitedInventors: Yoshiaki Yanagida, Teruaki Nishioka, Koji Sudo, Shunsuke Sone, Tomokazu Sugiyama
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Publication number: 20010012748Abstract: Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.Type: ApplicationFiled: December 13, 2000Publication date: August 9, 2001Applicant: FUJITSU LIMITEDInventors: Shunsuke Sone, Yoshiaki Yanagida, Teruaki Nishioka, Koji Suto, Tomokazu Sugiyama