Patents by Inventor Teruaki Nishioka

Teruaki Nishioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090061737
    Abstract: A lap platen has a lapping surface contacting a surface of a work piece. A lap base has a support surface brought into contact with and supported by the lapping surface. An adapter has a first support part, a second support part and an arm part. The first support part is supported by the lap base. The work piece is attached to the second support part so that a surface of the work piece to be processed contacts the lapping surface. The arm part extends between the first and second support parts. A height adjusting mechanism adjusts a height from the lapping surface to the first support part. An inclination detector is provided to the adapter to detect an inclination of the adapter. The inclination of the adapter relative to the lapping surface is adjusted by adjusting the height of the first support part by the height adjusting mechanism.
    Type: Application
    Filed: June 18, 2008
    Publication date: March 5, 2009
    Applicant: FUJITSU LIMITED
    Inventors: Koji Sudo, Yoshiaki Yanagida, Teruaki Nishioka
  • Publication number: 20080182484
    Abstract: A lapping apparatus includes a lapping plate having a lapping surface thereon that moves relative to a work. The lapping apparatus can adjust an inclination of the work in a latitudinal direction, thereby obtained preferable parallelization of both a reading elements and writing element to the lapping surface. As a result, the lapping apparatus can provide magnetic heads suitable for the perpendicular recording.
    Type: Application
    Filed: January 28, 2008
    Publication date: July 31, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Koji Sudo, Yoshiaki Yanagida, Teruaki Nishioka
  • Patent number: 7014532
    Abstract: A lapping machine comprises a lapping surface plate (1) rotated by a rotating mechanism, a lapping jig (28) having a plurality of projections to bottom surfaces of which a work (30) to be lapped by a lapping surface on the lapping surface plate (1) is fitted, amount-of-projection adjusting elements (29) for adjusting the variation of the plurality of projections (28c) to the lapping surface plate (1) individually, and a control circuit (36) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements (29).
    Type: Grant
    Filed: April 13, 2004
    Date of Patent: March 21, 2006
    Assignee: Fujitsu Limited
    Inventors: Teruaki Nishioka, Kazuo Yokoi, Yoshiaki Yanagida, Shunsuke Sone
  • Patent number: 6913509
    Abstract: Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.
    Type: Grant
    Filed: June 12, 2003
    Date of Patent: July 5, 2005
    Assignee: Fujitsu Limited
    Inventors: Shunsuke Sone, Yoshiaki Yanagida, Teruaki Nishioka, Koji Suto
  • Publication number: 20040209546
    Abstract: A lapping machine comprises a lapping surface plate (1) rotated by a rotating mechanism, a lapping jig (28) having a plurality of projections to bottom surfaces of which a work (30) to be lapped by a lapping surface on the lapping surface plate (1) is fitted, amount-of-projection adjusting elements (29) for adjusting the variation of the plurality of projections (28c) to the lapping surface plate (1) individually, and a control circuit (36) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements (29).
    Type: Application
    Filed: April 13, 2004
    Publication date: October 21, 2004
    Applicant: Fujitsu Limited
    Inventors: Teruaki Nishioka, Kazuo Yokoi, Yoshiaki Yanagida, Shunsuke Sone
  • Patent number: 6722947
    Abstract: A lapping machine comprises a lapping surface plate (1) rotated by a rotating mechanism, a lapping jig (28) having a plurality of projections to bottom surfaces of which a work (30) to be lapped by a lapping surface on the lapping surface plate (1) is fitted, amount-of-projection adjusting elements (29) for adjusting the variation of the plurality of projections (28c) to the lapping surface plate (1) individually, and a control circuit (36) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements (29).
    Type: Grant
    Filed: September 10, 2001
    Date of Patent: April 20, 2004
    Assignee: Fujitsu Limited
    Inventors: Teruaki Nishioka, Kazuo Yokoi, Yoshiaki Yanagida, Shunsuke Sone, Koji Sudo, Tomokazu Sugiyama
  • Publication number: 20030216106
    Abstract: Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.
    Type: Application
    Filed: June 12, 2003
    Publication date: November 20, 2003
    Applicant: Fujitsu Limited
    Inventors: Shunsuke Sone, Yoshiaki Yanagida, Teruaki Nishioka, Koji Suto
  • Patent number: 6599170
    Abstract: Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.
    Type: Grant
    Filed: December 13, 2000
    Date of Patent: July 29, 2003
    Assignee: Fujitsu Limited
    Inventors: Shunsuke Sone, Yoshiaki Yanagida, Teruaki Nishioka, Koji Suto, Tomokazu Sugiyama
  • Publication number: 20020052172
    Abstract: A lapping machine comprises a lapping surface plate (1) rotated by a rotating mechanism, a lapping jig (28) having a plurality of projections to bottom surfaces of which a work (30) to be lapped by a lapping surface on the lapping surface plate (1) is fitted, amount-of-projection adjusting elements (29) for adjusting the variation of the plurality of projections (28c) to the lapping surface plate (1) individually, and a control circuit (36) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements (29).
    Type: Application
    Filed: September 10, 2001
    Publication date: May 2, 2002
    Applicant: FUJITSU LIMITED
    Inventors: Teruaki Nishioka, Kazuo Yokoi, Yoshiaki Yanagida, Shunsuke Sone, Koji Sudo, Tomokazu Sugiyama
  • Patent number: 6315636
    Abstract: Disclosed herein is a lapping machine for lapping a row bar having a plurality of head sliders. The lapping machine includes a lap plate for providing a lapping surface, a row tool having a work surface for pressing the row bar against the lapping surface, and a mechanism for operating the row tool so that a given pressure distribution is produced between the row bar and the lapping surface. The row tool has a plurality of holes arranged along the work surface. The mechanism includes a plurality of pivoted links each having a load point where a force having a direction perpendicular to the work surface is applied to the row tool in each of the holes. Each of the pivoted links further has a support point as the fulcrum and an effort point where a force having a direction substantially parallel to the work surface is received. The ratio of a distance between the load point and the support point to a distance between the effort point and the support point is substantially constant.
    Type: Grant
    Filed: January 18, 2000
    Date of Patent: November 13, 2001
    Assignee: Fujitsu Limited
    Inventors: Yoshiaki Yanagida, Teruaki Nishioka, Koji Sudo, Shunsuke Sone, Tomokazu Sugiyama
  • Publication number: 20010012748
    Abstract: Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.
    Type: Application
    Filed: December 13, 2000
    Publication date: August 9, 2001
    Applicant: FUJITSU LIMITED
    Inventors: Shunsuke Sone, Yoshiaki Yanagida, Teruaki Nishioka, Koji Suto, Tomokazu Sugiyama