Patents by Inventor Teruaki NONOYAMA

Teruaki NONOYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device mounting board, electronic package, and electronic module
    Patent number: 11315844
    Abstract: A substrate has a first surface and a second surface opposite to the first surface. The substrate has at least one first recess on the first surface and a second recess on the second surface. The substrate includes electrode pads. The electrode pads are in the at least one first recess. The substrate has the at least one first recess located separate from the second recess in a plan view.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: April 26, 2022
    Assignee: KYOCERA CORPORATION
    Inventors: Fumiaki Takeshita, Teruaki Nonoyama
  • ELECTRONIC DEVICE MOUNTING BOARD, ELECTRONIC PACKAGE, AND ELECTRONIC MODULE
    Publication number: 20210242099
    Abstract: A substrate has a first surface and a second surface opposite to the first surface. The substrate has at least one first recess on the first surface and a second recess on the second surface. The substrate includes electrode pads. The electrode pads are in the at least one first recess. The substrate has the at least one first recess located separate from the second recess in a plan view.
    Type: Application
    Filed: January 31, 2019
    Publication date: August 5, 2021
    Applicant: KYOCERA Corporation
    Inventors: Fumiaki TAKESHITA, Teruaki NONOYAMA
  • Electronic device mounting board, electronic package, and electronic module
    Patent number: 10879184
    Abstract: In one aspect of this disclosure, an electronic device mounting board includes a substrate having a first surface and a second surface opposite to the first surface. The substrate has a first recess located on the first surface and a second recess located on the second surface. The substrate includes an electrode pad. The electrode pad is located in the first recess. The second recess in the substrate contains a reinforcement dividing the second recess into a plurality of recesses. The reinforcement is located separate from the electrode pad or is located to overlap the electrode pad in a plan view.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: December 29, 2020
    Assignee: Kyocera Corporation
    Inventors: Fumiaki Takeshita, Teruaki Nonoyama
  • ELECTRONIC DEVICE MOUNTING BOARD, ELECTRONIC PACKAGE, AND ELECTRONIC MODULE
    Publication number: 20200075495
    Abstract: In one aspect of this disclosure, an electronic device mounting board includes a substrate having a first surface and a second surface opposite to the first surface. The substrate has a first recess located on the first surface and a second recess located on the second surface. The substrate includes an electrode pad. The electrode pad is located in the first recess. The second recess in the substrate contains a reinforcement dividing the second recess into a plurality of recesses. The reinforcement is located separate from the electrode pad or is located to overlap the electrode pad in a plan view.
    Type: Application
    Filed: August 28, 2019
    Publication date: March 5, 2020
    Applicant: KYOCERA Corporation
    Inventors: Fumiaki TAKESHITA, Teruaki NONOYAMA