Patents by Inventor Teruaki Sato
Teruaki Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250018812Abstract: An automatic charging system includes: a vehicle driven by power; a charger having a charging cable having a charging connector; a position information acquisition device for obtaining position information of a charging port of the vehicle; a charging robot having a robot arm; and a detection device, which detects an operation of the charging port displaced in a vertical direction. Further, the charging robot insert the charging connector into the charging port based on the position information, and in a case where the detection device detects the operation of the charging port displaced in the vertical direction during a time period from when the position information acquisition device acquires the position information to when the insertion of the charging connector into the charging port is completed, the acquisition of the position information by the position information acquisition device is newly done again.Type: ApplicationFiled: July 2, 2024Publication date: January 16, 2025Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Masaaki SATO, Takeru SHIRASAWA, Yusuke SAITO, Teruaki HAIBARA
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Publication number: 20240101818Abstract: There is provided an aqueous heat-sealable resin composition which enables a laminate to have excellent heat sealing strength and blocking resistance. The disclosure relates to an aqueous heat-sealable resin composition which contains a urethane resin (A) which is a product of reaction components including a polyether polyol (a1), a polyisocyanate (a2) and a chain extender (a3) or the urethane resin (A) and a wax (B), and a laminate having a coating of the composition on at least one surface of a substrate.Type: ApplicationFiled: September 21, 2023Publication date: March 28, 2024Applicant: ARAKAWA CHEMICAL INDUSTRIES, LTD.Inventors: Keisuke Okada, Mayu Matsumoto, Teruaki Sato
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Publication number: 20230084251Abstract: The present disclosure provides a heat sealing aqueous resin composition containing: a rosin resin (A); a biodegradable resin (B) including a resin having a structure of General Formula (1) and/or a resin (b1) having a structure of General Formula (2); and a polyvinyl alcohol (C) in which an average saponification degree is 75 mol % or more and 85 mol % or less, in which a content of the component (b1) is more than 50% by mass when a total content of the component (A) and the component (B) is 100% by mass.Type: ApplicationFiled: August 24, 2022Publication date: March 16, 2023Applicant: ARAKAWA CHEMICAL INDUSTRIES, LTD.Inventors: Keisuke Okada, Kaito Kuroda, MAYU MATSUMOTO, Teruaki Sato
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Publication number: 20230077630Abstract: A water-based composition for barrier containing a urethane resin (A) which is comprising a polyol (a1), a polyisocyanate (a2) and a chain extender (a3) as essential reaction components, and at least one wax (B) selected from the group consisting of a paraffin, a carnauba and an alkyl ketene dimer, and further a content ratio between the component (A) and the component (B) in terms of the non-volatile content weight is (A)/(B)=25/75 to 95/5.Type: ApplicationFiled: August 23, 2022Publication date: March 16, 2023Applicant: ARAKAWA CHEMICAL INDUSTRIES, LTD.Inventors: Keisuke Okada, Kaito Kuroda, Teruaki Sato
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Publication number: 20220341095Abstract: A paper-strengthening agent comprising an amphoteric (meth)acrylamide polymer and an amphoteric (meth)acrylamide polymer, wherein each of constituent monomers of the amphoteric (meth)acrylamide polymer and the amphoteric (meth)acrylamide polymer comprises (meth)acrylamide, a cationic unsaturated monomer, an anionic unsaturated monomer, and a crosslinkable unsaturated monomer, and has a specific weight-average molecular weight, and wherein each viscosity of the paper-strengthening agent, the polymer, and the polymer satisfies a specific relationship.Type: ApplicationFiled: September 15, 2020Publication date: October 27, 2022Inventors: Makoto Kobayashi, Teruaki Sato, Tetsu Mizuko
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Patent number: 10908356Abstract: An optical circuit board which is mounted with a loop-back circuit for returning aligning light to the fiber array in the vicinity of the fiber array connection end. Since an aligning loop-back circuit can be formed in an optical waveguide pattern, a production cost does not increase in comparison to an optical circuit board of the related art. The aligning light combined from the optical fiber to the aligning port of the optical circuit board is returned to the optical fiber around the loop-back circuit. Therefore, it is possible to perform alignment using the returned light. That is, alignment can be performed while being mounted on a package without installing a light-reflecting film or mirror.Type: GrantFiled: November 2, 2017Date of Patent: February 2, 2021Assignees: NTT ELECTRONICS CORPORATION, NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Tomohiro Nakanishi, Motoki Minami, Satoru Konno, Yuichi Suzuki, Teruaki Sato, Shigeo Nagashima, Shinji Mino, Motohaya Ishii, Shunichi Soma, Shin Kamei, Shuichiro Asakawa
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Patent number: 10649147Abstract: An optical module that is connectable to an optical fiber array and that can be packaged in a high density. Two package modules are mounted on a board, and optical waveguides in a Si photonic lightwave circuit mounted on the package module are connected to an optical fiber array fixed to an optical fiber block. Moreover, output end surfaces of the optical waveguides in the Si photonic lightwave circuit are perpendicular to a mount surface of the package module. The optical waveguides in the Si photonic lightwave circuit may be tilted at an appropriate angle with respect to a direction perpendicular to a right end surface. Moreover, the optical fiber block fixes optical fibers with the optical fibers tilted with respect to a direction perpendicular to an end surface connected to the Si photonic lightwave circuit.Type: GrantFiled: May 12, 2017Date of Patent: May 12, 2020Assignees: NTT ELECTRONICS CORPORATION, NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Tomohiro Nakanishi, Teruaki Sato, Motohaya Ishii, Satoru Konno, Yuichi Suzuki, Shigeo Nagashima, Shinji Mino, Shuichiro Asakawa, Hiroshi Fukuda, Shin Kamei, Shunichi Soma, Ken Tsuzuki, Mitsuo Usui, Takashi Saida
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Publication number: 20200057192Abstract: An optical circuit board which is mounted with a loop-back circuit for returning aligning light to the fiber array in the vicinity of the fiber array connection end. Since an aligning loop-back circuit can be formed in an optical waveguide pattern, a production cost does not increase in comparison to an optical circuit board of the related art. The aligning light combined from the optical fiber to the aligning port of the optical circuit board is returned to the optical fiber around the loop-back circuit. Therefore, it is possible to perform alignment using the returned light. That is, alignment can be performed while being mounted on a package without installing a light-reflecting film or mirror.Type: ApplicationFiled: November 2, 2017Publication date: February 20, 2020Inventors: Tomohiro NAKANISHI, Motoki MINAMI, Satoru KONNO, Yuichi SUZUKI, Teruaki SATO, Shigeo NAGASHIMA, Shinji MINO, Motohaya ISHII, Shunichi SOMA, Shin KAMEl, Shuichiro ASAKAWA
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Publication number: 20190353844Abstract: An optical module which is connectable to an optical fiber array and which can be packaged in a high density. Two 30 mm square package modules are mounted on a board, and optical waveguides in a 20 mm square Si photonic lightwave circuit mounted on the package module are connected to an optical fiber array fixed to an optical fiber block (15×10 mm). Moreover, output end surfaces of the optical waveguides in the Si photonic lightwave circuit are perpendicular to a mount surface of the package module. In the embodiment, the optical waveguides in the Si photonic lightwave circuit are tilted at an appropriate angle, for example, 20 degrees with respect to a direction perpendicular to a right end surface. Moreover, the optical fiber block fixes optical fibers with the optical fibers tilted at 20 degrees with respect to a direction perpendicular to an end surface connected to the Si photonic lightwave circuit.Type: ApplicationFiled: May 12, 2017Publication date: November 21, 2019Inventors: Tomohiro Nakanishi, Teruaki Sato, Motohaya Ishii, Satoru Konno, Yuichi Suzuki, Shigeo Nagashima, Shinji Mino, Shuichiro Asakawa, Hiroshi Fukuda, Shin Kamei, Shunichi Soma, Ken Tsuzuki, Mitsuo Usui, Takashi Saida
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Patent number: 10039187Abstract: A flexible substrate having a branch structure in the related art has problems in that: adhesive strength after two bodies are folded and fixed at a bonding region decreases due to an unfolding and opening force at a curve portion and ends of the bonded portions are peeled off and generate gaps; and in a soldering process of the two bodies, the electrodes of one body soldered first are displaced due to reheating in soldering the other body secondly and deteriorate in soldered connection. The present invention provides a new flexible substrate having a branch structure, including first and second bodies joined together, and having a structure in which one of the bodies can be folded back in a longitudinal direction of the whole flexible substrate. Tip ends of the two bodies are provided with multiple electrodes, and are connected by soldering to approximately corresponding positions on both surfaces of an end portion of a printed substrate concerned.Type: GrantFiled: March 17, 2016Date of Patent: July 31, 2018Assignee: NTT ELECTRONICS CORPORATIONInventors: Kazumasa Yoshida, Toshiyuki Ozawa, Teruaki Sato, Atsushi Tomita, Yosuke Takeuchi, Shinji Mino, Yusuke Nasu
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Publication number: 20180124920Abstract: A flexible substrate having a branch structure in the related art has problems in that: adhesive strength after two bodies are folded and fixed at a bonding region decreases due to an unfolding and opening force at a curve portion and ends of the bonded portions are peeled off and generate gaps; and in a soldering process of the two bodies, the electrodes of one body soldered first are displaced due to reheating in soldering the other body secondly and deteriorate in soldered connection. The present invention provides a new flexible substrate having a branch structure, including first and second bodies joined together, and having a structure in which one of the bodies can be folded back in a longitudinal direction of the whole flexible substrate. Tip ends of the two bodies are provided with multiple electrodes, and are connected by soldering to approximately corresponding positions on both surfaces of an end portion of a printed substrate concerned.Type: ApplicationFiled: March 17, 2016Publication date: May 3, 2018Inventors: Kazumasa YOSHIDA, Toshiyuki OZAWA, Teruaki SATO, Atsushi TOMITA, Yosuke TAKEUCHI, Shinji MINO, Yusuke NASU
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Publication number: 20090147543Abstract: A DC-DC converter, which supplies a drive power to a display apparatus, includes a plurality of insulated transformers, a resonance capacitor, and a resonance coil. Primary coils of the plurality of insulated transformers, the resonance capacitor, and the resonance coil are connected in series to form a current resonance circuit, and secondary coils of the plurality of insulated transformers are connected in parallel.Type: ApplicationFiled: December 3, 2008Publication date: June 11, 2009Inventors: Yoshihiko SUGAWARA, Akihiko Kanouda, Tetsunosuke Nakamura, Kazunori Takahashi, Teruaki Sato, Takayuki Shindo, Shinpei Yao, Fusao Sakuramori
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Publication number: 20060099388Abstract: A corrugated fiberboard sheet includes three kinds of paperboards that are an outer paperboard, a corrugating medium and an inner paperboard. Each of the paperboards includes a paperboard of not less than three layers of raw material mainly of wastepaper. All the layers of each of the paperboards are given a waterproofing treatment. The ratio of incorporation of a fungusproofing agent and positions of incorporation satisfy the conditions (1) the ratio of incorporation of the fungusproofing agent in the outermost layers of the outer paperboard and the inner paperboard being in the range of 1 to 4%, (2) the ratio of incorporation of the fungusproofing agent in the innermost layers of the outer paperboard and the inner paperboard being in the range of 0.5 to 4% and (3) the ratio of incorporation of the fungusproofing agent in the opposite outermost layers of the corrugating medium being in the range of 0.5 to 4%.Type: ApplicationFiled: July 28, 2003Publication date: May 11, 2006Applicant: Nippon Daishowa Paperboard co., ltdInventors: Hideharu Kawagishi, Taisuke Isobe, Etsuji Kawamoto, Teruaki Sato, Fumioka Mizukami
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Patent number: 6002246Abstract: In a flyback transformer, an insulating cover is interposed between a main body casing and a focusing pack casing. A through-hole is formed through a ceramic resistor accommodated in the focusing pack casing. A fixing hole is formed through the insulating cover in a coaxial relationship with the through-hole. A slider is fixed on a rotatable knob for a variable resistor, which is supported on the focusing pack casing. One of two tongues of the slider is maintained in contact under pressure with a variable resistor of the ceramic resistor, and the other tongue is arranged coaxially with the fixing hole and is maintained in contact under pressure with a wire-shaped output terminal. The terminal is press-fitted in the fixing hole. Another flyback transformer is also disclosed, which comprises a cylindrical holder portion.Type: GrantFiled: September 17, 1998Date of Patent: December 14, 1999Assignee: Hitachi Media Electronics Co., Ltd.Inventors: Kiyohiko Gohkon, Teruaki Sato, Mitsuhiro Kanno, Akira Kikuchi