Patents by Inventor Teruaki Uezaki

Teruaki Uezaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7722792
    Abstract: In an injection mold, a compression pin is placed at a cavity surface by the pressing force of a biasing member, and is moved rearward by the pressure of filled resin so as to form a compression boss. After the completion of filling, the compression boss is compressed by the compression pin.
    Type: Grant
    Filed: January 30, 2008
    Date of Patent: May 25, 2010
    Assignee: Canon Kabushiki Kaisha
    Inventors: Teruaki Uezaki, Takashi Arai, Yoshihiro Iitsuka
  • Publication number: 20080185747
    Abstract: In an injection mold, a compression pin is placed at a cavity surface by the pressing force of a biasing member, and is moved rearward by the pressure of filled resin so as to form a compression boss. After the completion of filling, the compression boss is compressed by the compression pin.
    Type: Application
    Filed: January 30, 2008
    Publication date: August 7, 2008
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Teruaki Uezaki, Takashi Arai, Yoshihiro Iitsuka