Abstract: A substrate processing apparatus includes a robot arm for conveying a substrate, a conveyance chamber containing the robot arm, and an adjacent processing unit adjacent to the conveyance chamber, the adjacent processing unit processing a substrate therein. The conveyance chamber is constructed so as to be able to have a first shape for providing a predetermined space between the conveyance chamber and the adjacent processing unit, and a second shape for increasing the internal space of the conveyance chamber by making the distance between the conveyance chamber and the adjacent processing unit smaller than when the first shape is formed.

Abstract: A substrate processing apparatus includes a robot arm for conveying a substrate, a conveyance chamber containing the robot arm, and an adjacent processing unit adjacent to the conveyance chamber, the adjacent processing unit processing a substrate therein. The conveyance chamber is constructed so as to be able to have a first shape for providing a predetermined space between the conveyance chamber and the adjacent processing unit, and a second shape for increasing the internal space of the conveyance chamber by making the distance between the conveyance chamber and the adjacent processing unit smaller than when the first shape is formed.

Abstract: A semiconductor wafer manufacturing apparatus is equipped with a diagnostic module for diagnosing integrity of a transfer robot. The diagnostic module is attached to one side of a semiconductor wafer transfer chamber provided with the transfer robot, which side is also used for the purpose of maintenance, for example. One or more sensors are installed in the diagnostic module so that when the transfer robot is inserted into the diagnostic module, the position or shape of each end effector of the transfer robot is detected and compared against a pre-registered normal condition, thereby diagnosing the integrity of the end effector of the transfer robot, while performing wafer processing.

Abstract: A semiconductor manufacturing apparatus includes a processing unit for processing at least one wafer; a loading/unloading unit for loading/unloading at least wafer; an input/output chamber for taking in a processed wafer from the processing unit and taking out the processed wafer to the loading/unloading unit, and taking in a unprocessed wafer from the loading/unloading unit and taking out the unprocessed wafer to the reaction unit; and a wafer inspection device for inspecting the processed wafer through a light transmittable top portion of the input/output chamber, through which light is transmittable, while the processed wafer is temporarily placed in the input/output chamber.

Abstract: A semiconductor-processing apparatus includes: a wafer transfer chamber provided with a wafer transfer robot having an end effector therein, at least one reactor connected to the wafer transfer chamber, and a robot diagnostic module connected to the wafer transfer chamber for diagnosing the transfer robot. The robot diagnostic module includes at least one sensor for detecting a position of the end effector when the end effector is located inside the robot diagnostic module.

Abstract: A semiconductor manufacturing apparatus includes a processing unit for processing at least one wafer; a loading/unloading unit for loading/unloading at least wafer; an input/output chamber for taking in a processed wafer from the processing unit and taking out the processed wafer to the loading/unloading unit, and taking in a unprocessed wafer from the loading/unloading unit and taking out the unprocessed wafer to the reaction unit; and a wafer inspection device for inspecting the processed wafer through a light transmittable top portion of the input/output chamber, through which light is transmittable, while the processed wafer is temporarily placed in the input/output chamber.

Abstract: A semiconductor manufacturing apparatus includes a wafer handling chamber; at least one wafer input/output chamber attached to the wafer handling chamber; and multiple wafer processing chambers attached to the wafer handling chamber. The wafer handling chamber has a polygonal shape on a processing chamber level on which the wafer processing chambers are installed, and one wafer processing chamber is installed on each and every side of the polygon.