Patents by Inventor Teruhiko KODAMA
Teruhiko KODAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11887869Abstract: A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.Type: GrantFiled: September 6, 2021Date of Patent: January 30, 2024Assignee: TOKYO ELECTRON LIMITEDInventors: Nobuhiko Mouri, Takanori Obaru, Yasushi Takiguchi, Teruhiko Kodama
-
Patent number: 11693319Abstract: A method of processing a substrate, includes emitting light including vacuum ultraviolet light to a front surface of the substrate, which has a resist film formed thereon from a resist material for EUV lithography, before an exposure process in an interior of a processing container.Type: GrantFiled: October 8, 2021Date of Patent: July 4, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Keiichi Tanaka, Kosuke Yoshihara, Yoshihiro Kondo, Makoto Muramatsu, Teruhiko Kodama
-
Publication number: 20230197475Abstract: A substrate processing apparatus includes: a substrate holder configured to hold a substrate while being locally superimposed on a back surface of the substrate; a light irradiator configured to irradiate the back surface with light so as to remove an organic substance on the back surface of the substrate; a light shielding member provided at a back side of the substrate while being spaced apart from the back surface so as to prevent the light from being supplied to a front surface of the substrate; and a holding position changing mechanism configured to change a holding position by the substrate holder on the back surface of the substrate so as to irradiate the entire back surface of the substrate with the light.Type: ApplicationFiled: December 19, 2022Publication date: June 22, 2023Inventors: Teruhiko KODAMA, Yuzo OHISHI, Yoshitaka MATSUDA
-
Patent number: 11554389Abstract: A substrate cleaning apparatus configured to clean a surface of a substrate having a circular shape by bringing a cleaning member into contact with the surface of the substrate and rotating the substrate and the cleaning member relatively is provided. A contact region of the cleaning member which comes into contact with the surface of the substrate is widened in a radial shape from a center side of the substrate toward a peripheral side thereof.Type: GrantFiled: January 20, 2021Date of Patent: January 17, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Akihiro Kubo, Yasushi Takiguchi, Teruhiko Kodama, Yoshiki Okamoto
-
Patent number: 11532487Abstract: A substrate processing apparatus includes a polishing member having a polishing surface configured to perform a polishing of a main surface of a substrate; a first dressing member having a first dressing surface configured to perform a dressing of the polishing surface; a second dressing member having a second dressing surface configured to perform a dressing of the first dressing surface; a holding member configured to hold the polishing member and the second dressing member; and a driving unit configured to, by moving the holding member, switch a first state in which the first dressing surface and the polishing surface come into contact with each other to perform the dressing of the polishing surface and a second state in which the first dressing surface and the second dressing surface come into contact with each other to perform the dressing of the first dressing surface.Type: GrantFiled: May 12, 2020Date of Patent: December 20, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Akihiro Kubo, Yasushi Takiguchi, Teruhiko Kodama, Yoshiki Okamoto, Hayato Hosaka
-
Publication number: 20220113628Abstract: A method of processing a substrate, includes emitting light including vacuum ultraviolet light to a front surface of the substrate, which has a resist film formed thereon from a resist material for EUV lithography, before an exposure process in an interior of a processing container.Type: ApplicationFiled: October 8, 2021Publication date: April 14, 2022Inventors: Keiichi TANAKA, Kosuke YOSHIHARA, Yoshihiro KONDO, Makoto MURAMATSU, Teruhiko KODAMA
-
Patent number: 11287798Abstract: A substrate processing apparatus includes a film-forming device that forms a photosensitive film on a front surface of a substrate, a warping data acquisition device that acquires measured warping data of the substrate, a roughening process device that applies roughening process on a back surface of the substrate, and a control device including circuitry that controls the warping data acquisition device such that after the photosensitive film is formed on the front surface of the substrate, the warping data acquisition device acquires the measured warping data before the photosensitive film on the substrate undergoes exposure process, and control the roughening process device such that before the photosensitive film on the substrate undergoes the exposure process, the roughening process device applies the roughening process on the back surface of the substrate based on the measured warping data.Type: GrantFiled: November 26, 2019Date of Patent: March 29, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Teruhiko Kodama, Masashi Enomoto
-
Publication number: 20210398827Abstract: A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.Type: ApplicationFiled: September 6, 2021Publication date: December 23, 2021Inventors: Nobuhiko Mouri, Takanori Obaru, Yasushi Takiguchi, Teruhiko Kodama
-
Patent number: 11139182Abstract: A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.Type: GrantFiled: December 10, 2018Date of Patent: October 5, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Nobuhiko Mouri, Takanori Obaru, Yasushi Takiguchi, Teruhiko Kodama
-
Patent number: 11126086Abstract: A substrate treatment apparatus for applying a coating solution to a front surface of a substrate and developing an exposed coating film on the front surface of the substrate, includes a film forming unit configured to form a friction reducing film on a rear surface of the substrate before exposure processing, the friction reducing film reducing friction between the rear surface of the substrate and a holding surface for holding the rear surface of the substrate in the exposure processing.Type: GrantFiled: December 24, 2018Date of Patent: September 21, 2021Assignee: Tokyo Electron LimitedInventors: Teruhiko Kodama, Koichi Matsunaga
-
Publication number: 20210220878Abstract: A substrate cleaning apparatus configured to clean a surface of a substrate having a circular shape by bringing a cleaning member into contact with the surface of the substrate and rotating the substrate and the cleaning member relatively is provided. A contact region of the cleaning member which comes into contact with the surface of the substrate is widened in a radial shape from a center side of the substrate toward a peripheral side thereof.Type: ApplicationFiled: January 20, 2021Publication date: July 22, 2021Inventors: Akihiro Kubo, Yasushi Takiguchi, Teruhiko Kodama, Yoshiki Okamoto
-
Publication number: 20210039221Abstract: A substrate warpage correction method according to this disclosure corrects warpage of a substrate without performing a process on a front surface of the substrate. The substrate warpage correction method includes a surface roughening of performing a surface roughening process on a rear surface of the substrate using a surface roughening processing apparatus configured to be able to perform the surface roughening process on the rear surface of the substrate, to form grooves in the rear surface to thereby correct the warpage of the substrate.Type: ApplicationFiled: February 26, 2019Publication date: February 11, 2021Inventors: Nozomu KANETAKE, Akihiro KUBO, Teruhiko KODAMA, Taro YAMAMOTO, Yasushi TAKIGUCHI, Yoshiki OKAMOTO, Hayato HOSAKA
-
Publication number: 20200365417Abstract: A substrate processing apparatus includes a polishing member having a polishing surface configured to perform a polishing of a main surface of a substrate; a first dressing member having a first dressing surface configured to perform a dressing of the polishing surface; a second dressing member having a second dressing surface configured to perform a dressing of the first dressing surface; a holding member configured to hold the polishing member and the second dressing member; and a driving unit configured to, by moving the holding member, switch a first state in which the first dressing surface and the polishing surface come into contact with each other to perform the dressing of the polishing surface and a second state in which the first dressing surface and the second dressing surface come into contact with each other to perform the dressing of the first dressing surface.Type: ApplicationFiled: May 12, 2020Publication date: November 19, 2020Inventors: Akihiro Kubo, Yasushi Takiguchi, Teruhiko Kodama, Yoshiki Okamoto, Hayato Hosaka
-
Patent number: 10840079Abstract: A substrate processing apparatus includes: a first holding part configured to hold a substrate; a second holding part configured to hold the substrate; a sliding member configured to rotate about a vertical axis so that the sliding member slides on a back surface of the substrate; a revolution mechanism configured to revolve the sliding member under rotation about a vertical revolution axis; and a relative movement mechanism configured to horizontally move a relative position between the substrate and a revolution trajectory of the sliding member so that when the substrate is held by the first holding part, the sliding member slides on a central portion of the back surface of the substrate, and when the substrate is held by the second holding part, the sliding member slides on the peripheral portion of the back surface of the substrate under rotation.Type: GrantFiled: November 28, 2017Date of Patent: November 17, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Yasushi Takiguchi, Taro Yamamoto, Yoshiki Okamoto, Hayato Hosaka, Teruhiko Kodama, Akihiro Kubo, Ryuto Ozasa, Yuji Ariuchi, Shinsuke Kimura
-
Patent number: 10649335Abstract: A substrate processing method, includes acquiring a height distribution along a radial direction of a substrate in a peripheral edge portion of a front surface of the substrate, forming an underlayer film on the entire front surface of the substrate so as to correct a drop of a height of the peripheral edge portion based on the height distribution, and forming a resist film on the entire surface of the underlayer film.Type: GrantFiled: August 26, 2016Date of Patent: May 12, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Teruhiko Kodama, Masashi Enomoto, Masahide Tadokoro, Takafumi Hashimoto
-
Publication number: 20200096966Abstract: A substrate processing apparatus includes a film-forming device that forms a photosensitive film on a front surface of a substrate, a warping data acquisition device that acquires measured warping data of the substrate, a roughening process device that applies roughening process on a back surface of the substrate, and a control device including circuitry that controls the warping data acquisition device such that after the photosensitive film is formed on the front surface of the substrate, the warping data acquisition device acquires the measured warping data before the photosensitive film on the substrate undergoes exposure process, and control the roughening process device such that before the photosensitive film on the substrate undergoes the exposure process, the roughening process device applies the roughening process on the back surface of the substrate based on the measured warping data.Type: ApplicationFiled: November 26, 2019Publication date: March 26, 2020Applicant: TOKYO ELECTRON LIMITEDInventors: Teruhiko KODAMA, Masashi ENOMOTO
-
Patent number: 10528028Abstract: A substrate processing system includes a film-forming device to form photosensitive film on substrate, an exposure device to expose the film on the substrate, a relay device to transfer the substrate between the film-forming and exposure devices, a warping data acquisition device to acquire measured warping data of the substrate, a communication device to perform data communication with the exposure device, and a control device including film-forming, relay, measuring, and communication control sub-devices. The film-forming sub-device controls the film-forming device to form the film on the substrate, the relay sub-device controls the relay device to transfer the substrate to the exposure device, the measuring sub-device controls the warping data acquisition device to acquire the data after the controlling by the film-forming sub-device prior to the controlling by the relay sub-device, and the communication sub-device controls the communication device to transmit the data to the exposure device.Type: GrantFiled: February 1, 2017Date of Patent: January 7, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Teruhiko Kodama, Masashi Enomoto
-
Publication number: 20190212653Abstract: A substrate treatment apparatus for applying a coating solution to a front surface of a substrate and developing an exposed coating film on the front surface of the substrate, includes a film forming unit configured to form a friction reducing film on a rear surface of the substrate before exposure processing, the friction reducing film reducing friction between the rear surface of the substrate and a holding surface for holding the rear surface of the substrate in the exposure processing.Type: ApplicationFiled: December 24, 2018Publication date: July 11, 2019Inventors: Teruhiko KODAMA, Koichi MATSUNAGA
-
Publication number: 20190181022Abstract: A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.Type: ApplicationFiled: December 10, 2018Publication date: June 13, 2019Inventors: Nobuhiko Mouri, Takanori Obaru, Yasushi Takiguchi, Teruhiko Kodama
-
Patent number: 10074542Abstract: There is provided a substrate processing method which includes polishing a rear surface of a substrate before a pattern exposure such that the rear surface is subjected to a roughening treatment; and bypassing a roughness alleviating treatment with respect to the polished rear surface of the substrate.Type: GrantFiled: September 16, 2016Date of Patent: September 11, 2018Assignee: TOKYO ELECTRON LIMITEDInventors: Akihiro Kubo, Teruhiko Kodama