Patents by Inventor Teruhiko NISHIKAWA

Teruhiko NISHIKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210283745
    Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.
    Type: Application
    Filed: May 28, 2021
    Publication date: September 16, 2021
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventors: Takahiro IIDA, Teruhiko NISHIKAWA, Tasuku SHIMIZU
  • Publication number: 20210245324
    Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.
    Type: Application
    Filed: March 3, 2020
    Publication date: August 12, 2021
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventors: Takahiro IIDA, Teruhiko NISHIKAWA, Tasuku SHIMIZU
  • Publication number: 20210178621
    Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.
    Type: Application
    Filed: February 26, 2021
    Publication date: June 17, 2021
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventors: Takahiro IIDA, Teruhiko NISHIKAWA, Tasuku SHIMIZU
  • Publication number: 20210178550
    Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.
    Type: Application
    Filed: February 26, 2021
    Publication date: June 17, 2021
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventors: Takahiro IIDA, Teruhiko NISHIKAWA, Tasuku SHIMIZU