Patents by Inventor Teruhiko Yamamoto

Teruhiko Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220193835
    Abstract: A soldering device includes: a soldering iron; a driver for moving the soldering iron; an input receiver for receiving an input of size information of a workpiece; and a controller for controlling the driver. The controller sets a coordinate of a specific position at a predetermined distance away from a soldering position based on the size information, sets, a speed of a tip at a distant position to a predetermined speed, and sets, an evacuation speed from the soldering position to the specific position to a low speed which is lower than the predetermined speed.
    Type: Application
    Filed: March 9, 2022
    Publication date: June 23, 2022
    Inventors: Yuta Mishima, Teruhiko Yamamoto, Yoshitomo Teraoka
  • Patent number: 10981241
    Abstract: A solder feed structure has a solder exit aperture with an elongated shape. The elongated shape can help reduce the incidence of clogging, as it has a dimension that is significantly larger than the wire diameter of solder. The solder feed structure has a bent segment leading up to the solder exit aperture. The arc of the bent segment can cause the solder wire to be in a stable position at one end of the elongated shape of the solder exit aperture instead of wobbling within the solder exit aperture.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: April 20, 2021
    Assignee: HAKKO CORPORATION
    Inventors: Hiroyuki Masaki, Teruhiko Yamamoto
  • Publication number: 20180345398
    Abstract: A solder feed structure has a solder exit aperture with an elongated shape. The elongated shape can help reduce the incidence of clogging, as it has a dimension that is significantly larger than the wire diameter of solder. The solder feed structure has a bent segment leading up to the solder exit aperture. The arc of the bent segment can cause the solder wire to be in a stable position at one end of the elongated shape of the solder exit aperture instead of wobbling within the solder exit aperture.
    Type: Application
    Filed: May 24, 2018
    Publication date: December 6, 2018
    Inventors: Hiroyuki MASAKI, Teruhiko YAMAMOTO
  • Patent number: 5624161
    Abstract: A seat cushion pad supporting construction has a base frame having an opening, and a planar spring deck disposed substantially over the opening. The planar spring deck is formed of a rectangular boundary frame and flexible support members extending front-to-rear between front and rear boundary frame portions of the boundary frame. The flexible support members may be spring steel wires or flexible planar members made of synthetic resin, rubber or fabric. The spring deck is non-resiliently connected at its front boundary frame portion to a front portion of the base frame adjacent the opening to be vertically pivotable with respect to the front base frame portion. The rear boundary frame portion is resiliently connected by tension springs to a rear portion of the base frame adjacent the opening. Optional front and side protruding spring frames are connected to the boundary frame to support the upper legs of an occupant.
    Type: Grant
    Filed: December 28, 1994
    Date of Patent: April 29, 1997
    Assignee: Takashimaya Nippatsu Kogyo Co., Ltd.
    Inventors: Yuuichi Sorimachi, Wataru Itou, Yasushi Yoshino, Teruhiko Yamamoto
  • Patent number: 5358566
    Abstract: An aqueous solution, for use as a cement dispersing agent, of a polymer salt, which is formed by reacting a polycarboxylic acid with a nitrogenous acrylic polymer.
    Type: Grant
    Filed: November 5, 1990
    Date of Patent: October 25, 1994
    Assignee: Sandoz Ltd.
    Inventors: Yoshio Tanaka, Minoru Yaguchi, Teruhiko Yamamoto