Abstract: A hard disk drive flexible printed circuit (FPC) includes a plurality of fingers extending from a main portion, with each finger having a first wiring layer including a first electrically conductive trace layout, a second wiring layer including a second electrically conductive trace layout, and a base film interposed between the first and second wiring layers, where the first conductive trace layout includes at least one thermally conductive protective island overlaying a respective portion of the second trace layout to provide a protective thermal barrier to the base film. Hence, maximum temperatures across various layers of the FPC laminate can be reduced, damage to the FPC prevented, and manufacturing yields improved.

Abstract: A hard disk drive flexible printed circuit (FPC) includes a plurality of fingers extending from a main portion, with each finger having a first wiring layer including a first electrically conductive trace layout, a second wiring layer including a second electrically conductive trace layout, and a base film interposed between the first and second wiring layers, where the first conductive trace layout includes at least one thermally conductive protective island overlaying a respective portion of the second trace layout to provide a protective thermal barrier to the base film. Hence, maximum temperatures across various layers of the FPC laminate can be reduced, damage to the FPC prevented, and manufacturing yields improved.

Abstract: A hard disk drive flexible printed circuit (FPC) includes a plurality of fingers extending from a main portion, with each finger having a thermally-conductive stiffener, at least one wiring layer over the stiffener, and a cover film over the at least one wiring layer, where the centroid of the stiffener is offset from the centerline of the cover film. Thus, utilizing the heat-sink characteristics of the stiffener, temperature differences among the upper and lower electrical pads of the FPC resulting from a heat-based interconnection procedure can be reduced and the temperatures across the FPC finger made more uniform, damage to the FPC prevented, and soldering yields improved.

Abstract: A hard disk drive flexible printed circuit (FPC) includes a plurality of fingers extending from a main portion, with each finger having a first wiring layer including a first electrically conductive trace layout, a second wiring layer including a second electrically conductive trace layout, and a base film interposed between the first and second wiring layers, where the first conductive trace layout includes at least one thermally conductive protective island overlaying a respective portion of the second trace layout to provide a protective thermal barrier to the base film. Hence, maximum temperatures across various layers of the FPC laminate can be reduced, damage to the FPC prevented, and manufacturing yields improved.

Abstract: A hard disk drive flexible printed circuit (FPC) includes a plurality of fingers extending from a main portion, with each finger having a thermally-conductive stiffener, at least one wiring layer over the stiffener, and a cover film over the at least one wiring layer, where the centroid of the stiffener is offset from the centerline of the cover film. Thus, utilizing the heat-sink characteristics of the stiffener, temperature differences among the upper and lower electrical pads of the FPC resulting from a heat-based interconnection procedure can be reduced and the temperatures across the FPC finger made more uniform, damage to the FPC prevented, and soldering yields improved.

Abstract: A hard disk drive suspension includes a suspension tail configured to electrically connect to a read-write transducer at a distal end and extending in a proximal direction toward a tapered tip at a proximal end, where the tapered tip comprises a decreasing taper that narrows in the proximal direction. Hence, structural overlap among adjacent suspension tails in misalignment scenarios and consequent marginalized electrical connections between the suspension tail and a corresponding flexible printed circuit are inhibited. The most proximal electrical pads of the suspension tail may be configured with a different aspect ratio, or in a fewer number of lines, from other adjacent electrical pads, thereby fitting within the narrowest portion of the tapered tip.

Abstract: Described herein is a multilayer flex circuit having a first dual flex circuit and a second dual flex circuit where each one comprises an outer metal layer, a base insulation layer, and an inner metal layer. The base insulation layer is disposed between the outer metal layer and the inner metal layer. The inner metal layer of the first dual flex circuit is configured to face toward the inner metal layer of the second dual flex circuit. The multilayer flex circuit also includes a coupling layer that adhesively couples the inner metal layer of the first dual flex circuit to the inner metal layer of the second dual flex circuit. The multilayer flex circuit also comprises an electrically conductive material that electrically connects the inner metal layer of the second dual flex circuit to the inner metal layer of the first dual flex circuit.

Abstract: Described herein is a multilayer flex circuit having a first dual flex circuit and a second dual flex circuit where each one comprises an outer metal layer, a base insulation layer, and an inner metal layer. The base insulation layer is disposed between the outer metal layer and the inner metal layer. The inner metal layer of the first dual flex circuit is configured to face toward the inner metal layer of the second dual flex circuit. The multilayer flex circuit also includes a coupling layer that adhesively couples the inner metal layer of the first dual flex circuit to the inner metal layer of the second dual flex circuit. The multilayer flex circuit also comprises an electrically conductive material that electrically connects the inner metal layer of the second dual flex circuit to the inner metal layer of the first dual flex circuit.

Abstract: Described herein is a connector assembly that comprises a head-gimbal assembly (HGA) tail connector, a flex connector, and an adhesive. The HGA tail connector comprises a pad support, an HGA pad coupled to the pad support, and an HGA trace coupled to the pad support and electrically coupled to the HGA pad. The flex connector comprises a substrate, comprising a first side and a second side, where the first side is opposite the second side. The flex connector also comprises a flex pad coupled to the first side of the substrate, a flex trace coupled to the second side of the substrate, and a via extending through the substrate from the first side to the second side. The via electrically couples the flex pad and the flex trace. Also, the adhesive adheres the HGA pad of the HGA connector in electrical contact with the flex pad of the flex connector.

Abstract: A hard disk drive (HDD) enclosure base is described, in which a mechanical feature is implemented that mitigates the propagation of vibration through the base. For example, an HDD base as described can mitigate the propagation of vibration to the head suspension and thereby eliminate read-back signal losses resulting from such vibration, such as in response to an op-shock event.

Abstract: A disk-enclosure base that is configured to inhibit formation of adherent solder-flux residue. The disk-enclosure base includes a casting, a through-hole fabricated in the casting, a solder channel, an E-coat layer, and an E-coat-free zone. The E-coat layer is applied to a first portion of an interior surface of the casting. The E-coat-free zone is adjacent to and surrounds the solder channel. The E-coat-free zone also includes a second portion of the interior surface of the casting lying between the solder channel and the E-coated first portion of the interior surface of the casting. The E-coat-free zone is configured to inhibit formation of adherent solder-flux residue. A disk-enclosure-base/electrical-feedthrough assembly that is configured to inhibit formation of adherent solder-flux residue, and a hard-disk drive (HDD) including the disk-enclosure-base/electrical-feedthrough assembly are also provided.

Abstract: An example hard disk drive (HDD) comprising a magnetic disk and a ramp within the HDD is disclosed. A slit is disposed between a ramp body and a flange.

Abstract: An example hard disk drive (HDD) comprising a magnetic disk and a ramp within the HDD is disclosed. A slit is disposed between a ramp body and a flange.

Abstract: A magnetic disk device including a disk, a spindle motor, a base for supporting the spindle motor and the disk, a slider includes a head element. The device also includes an actuator including arms for supporting the slider and a coil of a voice coil motor for rotating the arms, wherein a first natural bending frequency of the coil is less than a first natural bending frequency of the arms.

Abstract: A disk-enclosure base that is configured to inhibit formation of adherent solder-flux residue. The disk-enclosure base includes a casting, a through-hole fabricated in the casting, a solder channel, an E-coat layer, and an E-coat-free zone. The E-coat layer is applied to a first portion of an interior surface of the casting. The E-coat-free zone is adjacent to and surrounds the solder channel. The E-coat-free zone also includes a second portion of the interior surface of the casting lying between the solder channel and the E-coated first portion of the interior surface of the casting. The E-coat-free zone is configured to inhibit formation of adherent solder-flux residue. A disk-enclosure-base/electrical-feedthrough assembly that is configured to inhibit formation of adherent solder-flux residue, and a hard-disk drive (HDD) including the disk-enclosure-base/electrical-feedthrough assembly are also provided.

Abstract: A magnetic disk device including a disk, a spindle motor, a base for supporting the spindle motor and the disk, a slider includes a head element. The device also includes an actuator including arms for supporting the slider and a coil of a voice coil motor for rotating the arms, wherein a first natural bending frequency of the coil is less than a first natural bending frequency of the arms.

Abstract: Embodiments of the present invention help to achieve a solder joining structure having high reliability, in which even if a componential material of a flange of a feed-through of a sealed magnetic disk drive is an iron-based material such as Kovar™, and a componential material of a base of the drive is an aluminum-based alloy, leakage of low-density gas is dramatically reduced. According to one embodiment, a base has a stepped portion in the inside of a periphery of an opening, and an inclined surface extending to the outside of the base is formed at an edge of a surface of the stepped portion, on which a flange of a feed-through is placed, thereby when the stepped portion of the base is joined by soldering with the flange of the feed-through, a solder fillet is formed not only in the inside of the base, but also in the outside thereof.

Abstract: For cushioning a shock to prevent problems such as a reading error, a ramp for a magnetic disc apparatus is made of a resin material for forming a ramp main body and a material having higher rigidity than the resin material, disc facing surfaces in the disc insertion portion for inserting a magnetic disc is provided with disc contact portions made of the high rigidity material, a bottom surface portion of a concave portion of the disc insertion portion is constructed by a combination of a bottom surface portion made of the resin material and a bottom surface portion made of the high rigidity material, and a step structure is provided by arranging the bottom surface portion made of the high rigidity material at a position moved rearward in a depth direction of the concave portion in comparison with the bottom surface portion made of the resin material.

Abstract: To efficiently manufacture a feedthrough used in a disk drive device having a hermetically sealed enclosure, embodiments of the present invention manufacture a feedthrough used in an HDD having a hermetically sealed enclosure. An embodiment of a manufacturing method of the present embodiment manufactures a columnar body, cuts the columnar body in the direction vertical to the axes of pins, and cuts out a feedthrough. Then, necessary plating is made on the outer surfaces of the cut out feedthrough. The columnar body comprises a hollow tube, a plurality of pins inserted inside the tube, and an insulating sealant filled inside the tube. This manufacturing method achieves efficient manufacture of the feedthrough.

Abstract: Embodiments of the present invention help to provide a sealed hard disk drive (HDD) with high reliability. According to one embodiment, a HDD is a hermetically sealed HDD. A base has an opening of a through-hole on its bottom; a feedthrough is provided so as to close the opening. A flange of the feedthrough has a larger outline than the opening, and its rim is joined to the base with solder at the solder joint. The solder at the solder joint is mainly composed of Sn and contains 15 atomic percent to 27 atomic percent of indium. This solder reaches the ? phase from ?150° C. to 120° C. Accordingly, even if the HDD has been exposed at low temperature for a long time, the solder joint is not broken so that helium gas does not leak.