Patents by Inventor Teruhisa Hayashi

Teruhisa Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed wiring substrate and method for fabricating the same
    Patent number: 6809268
    Abstract: A printed wiring substrate 1 includes a core substrate 2 having a front surface 3 and a back surface 4 and an chip capacitor 10 serving as an electronic component embedded via a resin 13 in a through-hole 5 extending through the core substrate between the front surface 3 and the back surface 4. The chip capacitor 10 has an electrode 12 projecting from the upper and lower ends thereof. The resin 13 contains silica filler (inorganic filler) f. The maximum particle size d of the silica filler f is not greater than half the height h of the electrode 12.
    Type: Grant
    Filed: July 30, 2001
    Date of Patent: October 26, 2004
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Teruhisa Hayashi, Yasutake Hotta, Kouki Ogawa
  • Printed wiring substrate and method for fabricating the same
    Publication number: 20020033378
    Abstract: A printed wiring substrate 1 includes a core substrate 2 having a front surface 3 and a back surface 4 and an chip capacitor 10 serving as an electronic component embedded via a resin 13 in a through-hole 5 extending through the core substrate between the front surface 3 and the back surface 4. The chip capacitor 10 has an electrode 12 projecting from the upper and lower ends thereof. The resin 13 contains silica filler (inorganic filler) f. The maximum particle size d of the silica filler f is not greater than half the height h of the electrode 12.
    Type: Application
    Filed: July 30, 2001
    Publication date: March 21, 2002
    Applicant: NGK SPARK PLUG CO., LTD.
    Inventors: Teruhisa Hayashi, Yasutake Hotta, Kouki Ogawa