Abstract: A method for controlling a polyimide backbone structure, including: in preparation of a polyimide through reaction of a diamine component and (1S,2R,4S,5R)-cyclohexanetetracarboxylic dianhydride in an organic solvent containing an aprotic amide solvent and a lactone solvent, adjusting one or more of reaction conditions of a mass ratio of the aprotic amide solvent and the lactone solvent, a reaction temperature, a reaction time, and an amount of the aprotic amide solvent, so as to convert a cis-structure derived from the (1S,2R,4S,5R)-cyclohexanetetracarboxylic dianhydride in the formed polyimide to a trans-structure derived from (1R,2S,4S,5R)-cyclohexanetetracarboxylic dianhydride corresponding to the reaction conditions, thereby controlling a proportion of the trans-structure.

Abstract: Disclosed are a polyimide resin containing a structural unit represented by the following formula (1-1), and a polyimide film containing a structural unit represented by the following formula (1-2) and having a thickness of 10 to 50 ?m. R1 and R2 in the formula (1-1) each independently represent any group of the following formulae (i) to (iv), R1 and R2 in the formula (1-2) each independently represent a group of the following formula (i) or formula (ii), and in these formulae, * bonds to the carbon with * in the formula (1-1) and the formula (1-2) and ** bonds to the carbon with ** in the formula (1-1) and the formula (1-2). A polyimide resin capable of forming a polyimide film excellent in transparency and having a low coefficient of linear thermal expansion, and a polyimide film having a lower coefficient of linear thermal expansion are provided.

Abstract: Provided is a polyimide resin composition capable of forming a polyimide film which is excellent in transparency and heat resistance and has a low thermal linear expansion coefficient. The polyimide resin composition contains a polyimide resin produced by reacting (A) a tetracarboxylic dianhydride with (B) a diamine containing a phenolic hydroxyl group-containing diamine in an amount of from 5 to 100 mol % of the total diamine; and silica microparticles, in a ratio by mass of from 25/75 to 60/40.

Abstract: A method for controlling a polyimide backbone structure, including: in preparation of a polyimide through reaction of a diamine component and (1S,2R,4S,5R)-cyclohexanetetracarboxylic dianhydride in an organic solvent containing an aprotic amide solvent and a lactone solvent, adjusting one or more of reaction conditions of a mass ratio of the aprotic amide solvent and the lactone solvent, a reaction temperature, a reaction time, and an amount of the aprotic amide solvent, so as to convert a cis-structure derived from the (1S,2R,4S,5R)-cyclohexanetetracarboxylic dianhydride in the formed polyimide to a trans-structure derived from (1R,2S,4S,5R)-cyclohexanetetracarboxylic dianhydride corresponding to the reaction conditions, thereby controlling a proportion of the trans-structure.

Abstract: A polyimide resin contains repeating structural units represented by formulas (1) and (2), wherein the content of the repeating structural unit represented by formula (2) relative to the total of the repeating structural unit represented by formula (1) and the repeating structural unit represented by formula (2) falls within a specific range and the content of the divalent group represented by the following structural formula (B1) falls within a specific range: X1 represents a tetravalent group containing an alicyclic hydrocarbon structure and having a carbon number of from 4 to 22. X2 represents a tetravalent group containing an aromatic ring and having a carbon number of from 6 to 22.

Abstract: Disclosed are a polyimide resin containing a structural unit represented by the following formula (1-1), and a polyimide film containing a structural unit represented by the following formula (1-2) and having a thickness of 10 to 50 ?m. R1 and R2 in the formula (1-1) each independently represent any group of the following formulae (i) to (iv), R1 and R2 in the formula (1-2) each independently represent a group of the following formula (i) or formula (ii), and in these formulae, * bonds to the carbon with * in the formula (1-1) and the formula (1-2) and ** bonds to the carbon with ** in the formula (1-1) and the formula (1-2). A polyimide resin capable of forming a polyimide film excellent in transparency and having a low coefficient of linear thermal expansion, and a polyimide film having a lower coefficient of linear thermal expansion are provided.

Abstract: The present invention provides a polyimide resin composition capable of forming a film having heat resistance and transparency and, in addition thereto, mechanical strength, surface hardness and flex resistance, a polyimide resin, a polyimide film and a laminate. The present invention includes: a polyimide resin composition containing a polyimide resin that has structural units represented by specific structures in a specific ratio, containing silica fine particles; the polyimide resin; a polyimide film; and a laminate.

Abstract: A polyimide resin contains repeating structural units represented by formulas (1) and (2), wherein the content of the repeating structural unit represented by formula (2) relative to the total of the repeating structural unit represented by formula (1) and the repeating structural unit represented by formula (2) falls within a specific range and the content of the divalent group represented by the following structural formula (B1) falls within a specific range: X1 represents a tetravalent group containing an alicyclic hydrocarbon structure and having a carbon number of from 4 to 22. X2 represents a tetravalent group containing an aromatic ring and having a carbon number of from 6 to 22.

Abstract: Provided is a polyimide resin composition capable of forming a polyimide film which is excellent in transparency and heat resistance and has a low thermal linear expansion coefficient. The polyimide resin composition contains a polyimide resin produced by reacting (A) a tetracarboxylic dianhydride with (B) a diamine containing a phenolic hydroxyl group-containing diamine in an amount of from 5 to 100 mol % of the total diamine; and silica microparticles, in a ratio by mass of from 25/75 to 60/40.