Patents by Inventor Teruhito NAKATSU

Teruhito NAKATSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ALUMINUM ALLOY WIRE
    Publication number: 20200318226
    Abstract: An aluminum alloy wire manufacturing method comprises (A) a step for melting an aluminum alloy containing 0.40-0.55 mass % of Mg and 0.45-0.65 mass % of Si, the balance being obtained from Al and unavoidable impurities, (B) a step for casting molten metal of the aluminum alloy and rolling to form a rough-drawn wire rod, (C) a step for solutionizing the rough-drawn wire rod, (D) a step for drawing the rough-drawn wire rod after solutionizing to form a drawn wire rod with a wire diameter of 0.5 mm or less, and (E) a step for heat treatment so that internal strain is removed with substantially no deposition of Mg2Si.
    Type: Application
    Filed: June 23, 2020
    Publication date: October 8, 2020
    Inventors: Teruhito NAKATSU, Masahiro ICHIKAWA, Akira IMAI, Hiroyoshi YAMAZAKI, Susumu OHNEDA, Akira TAKEHIRA
  • ALUMINUM ALLOY WIRE MANUFACTURING METHOD AND ALUMINUM ALLOY WIRE
    Publication number: 20180171450
    Abstract: An aluminum alloy wire manufacturing method comprises (A) a step for melting an aluminum alloy containing 0.40-0.55 mass % of Mg and 0.45-0.65 mass % of Si, the balance being obtained from Al and unavoidable impurities, (B) a step for casting molten metal of the aluminum alloy and rolling to form a rough-drawn wire rod, (C) a step for solutionizing the rough-drawn wire rod, (D) a step for drawing the rough-drawn wire rod after solutionizing to form a drawn wire rod with a wire diameter of 0.5 mm or less, and (E) a step for heat treatment so that internal strain is removed with substantially no deposition of Mg2Si.
    Type: Application
    Filed: June 2, 2016
    Publication date: June 21, 2018
    Inventors: Teruhito NAKATSU, Masahiro ICHIKAWA, Akira IMAI, Hiroyoshi YAMAZAKI, Susumu OHNEDA, Akira TAKEHIRA