Patents by Inventor Terukazu Ebisawa

Terukazu Ebisawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9033406
    Abstract: A vehicle body includes: an opening that is formed in the rear surface; a rear panel assembly having a closed cross-sectional shape and being located at the lower edge of the opening and extending in the width direction of the vehicle; left and right rear wheel wells located in front of the rear panel assembly; and left and right gussets for panels, the gussets connecting the left and right rear wheel wells and the rear panel assembly. Each of the rear wheel wells forms a portion of each of the inner walls of the vehicle body side sections, and the rear wheel wells have support sections for supporting rear dampers for the left and right rear suspensions.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: May 19, 2015
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Daisuke Tokumoto, Terukazu Ebisawa, Masato Wakai, Masaaki Tatsuwaki, Manabu Nakayama
  • Publication number: 20130241240
    Abstract: A vehicle body includes: an opening that is formed in the rear surface; a rear panel assembly having a closed cross-sectional shape and being located at the lower edge of the opening and extending in the width direction of the vehicle; left and right rear wheel wells located in front of the rear panel assembly; and left and right gussets for panels, the gussets connecting the left and right rear wheel wells and the rear panel assembly. Each of the rear wheel wells forms a portion of each of the inner walls of the vehicle body side sections, and the rear wheel wells have support sections for supporting rear dampers for the left and right rear suspensions.
    Type: Application
    Filed: November 22, 2011
    Publication date: September 19, 2013
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Daisuke Tokumoto, Terukazu Ebisawa, Masato Wakai, Masaaki Tatsuwaki, Manabu Nakayama