Abstract: Provided is a carbon-dioxide capture and treatment system comprising: a carbon dioxide-enriched mixture gas generation device comprising a separation membrane capable of increasing a carbon dioxide concentration of a mixture gas taken therein, thereby generating a carbon dioxide-enriched mixture gas; a carbon dioxide conversion device configured to convert carbon dioxide in the enriched mixture gas received from the carbon dioxide-enriched mixture gas generation device, into a chemically stable compound; a final treatment device comprising an adsorbent, wherein the final treatment device is configured to adsorb the carbon dioxide by the adsorbent, thereby separating the carbon dioxide from other gas components; and a carbon dioxide direct capture device configured to take in air contained in an ambient environment, and supply the taken-in air to the final treatment device or an upstream side thereof in the carbon-dioxide capture and treatment system.

Abstract: The present invention provides a gas separation system suitable for reducing energy required to separate a gas mixture. A gas separation system of the present invention includes: a first separation membrane unit that separates a gas mixture containing carbon dioxide and nitrogen into a first permeated gas and a first non-permeated gas; a second separation membrane unit that separates the first permeated gas into a second permeated gas and a second non-permeated gas; a first decompression device that decompresses a permeation-side space of the first separation membrane unit; and a second decompression device that decompresses a permeation-side space of the second separation membrane unit.

Abstract: The present invention relates to a formate production method including: a first step of producing a formate by causing a reaction between carbon dioxide and hydrogen in a solution containing a solvent, a catalyst dissolved in the solvent, and a metal salt or an organic salt; and a second step of separating, by a separation membrane, the catalyst from a reaction solution obtained in the first step, in which the catalyst contains at least one metal element selected from the group consisting of metal elements belonging to Group 8, Group 9, and Group 10 of a periodic table.

Abstract: The present disclosure relates to a hydrogen gas production method including: a first step of generating a mixed gas containing hydrogen and carbon dioxide from a hydrogen storage agent by dehydrogenation reaction using a catalyst in a reactor; a second step of purifying the generated mixed gas to acquire a gas having a high hydrogen concentration; a third step of separating a solution in the reactor into a solution enriched with the catalyst and a permeate using a separation membrane unit; and a fourth step of supplying the solution enriched with the catalyst to the reactor for reusing in the first step.

Abstract: The present invention relates to an ionic liquid-containing structure including an ionic liquid composed of a pair of a cation and an anion, in which a HOMO energy level of the anion is higher than an LUMO energy level of the cation, and a difference between the HOMO energy level of the anion and the LUMO energy level of the cation is 0.2 a.u. or more.

Abstract: The present invention provides a separation membrane suitable for separating water from a liquid mixture containing an alcohol and water. A separation membrane 10 according to the present invention contains polyimide including a structural unit represented by formula (1). A is a linking group having a solubility parameter, in accordance with a Fedors method, of more than 5.0. B is a linking group having a solubility parameter of more than 8.56. R1 to R6 each are independently a hydrogen atom, a halogen atom, a hydroxyl group, a sulfonic group, an alkoxy group having 1 to 30 carbon atoms, or a hydrocarbon group having 1 to 30 carbon atoms. Ar1 and Ar2 each are a divalent aromatic group.

Abstract: The present invention relates to a method for producing an ionic liquid-containing structure, including: an inorganic network structure forming step of forming a network structure of an inorganic compound in the presence of an ionic liquid; and a polymer network structure forming step of forming a polymer network structure of a prepolymer and a crosslinking agent in the presence of the ionic liquid.

Abstract: An object of the present invention is to provide a method which can produce an ionic liquid-containing network structure with high productivity. A method for producing an ionic liquid-containing structure, which includes an inorganic particle network structure forming step of forming a network structure by inorganic particles in the presence of an ionic liquid, and a polymer network structure forming step of forming a network structure by polymerization of a monomer component containing at least a polar group-containing monomer in the presence of the ionic liquid is provided.

Abstract: An aspect of the present invention relates to a separation membrane for selectively separating a component (A) from a fluid containing the component (A) and a component (B), wherein the separation membrane has a first surface and a second surface opposite to the first surface, an affinity of the first surface side of the separation membrane for the component (A) is higher than an affinity of the first surface side of the separation membrane for the component (B), and an affinity of the second surface side of the separation membrane for the component (A) is higher than the affinity of the first surface side of the separation membrane for the component (A).

Abstract: A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove.

Abstract: First and second measurement probes come into contact with first and second electrode pads, respectively, and third and fourth measurement probes come into contact with the first and second electrode pads, respectively. A current flows in a current path including the first and second electrode pads and a plurality of lines through the first and second measurement probes. A value of the current in the current path is measured, and a value of a voltage between the third and fourth measurement probes is measured. Conductivity between the first and second electrode pads is inspected based on the measured value of the current and the measured value of the voltage.

Abstract: The present invention provides a measurement device which is compact and portable and is simply operated, and which is capable of quantifying the amount of an object to be inspected with high sensitivity and high accuracy. A measurement device of the present invention includes an SPR sensor cell, a light source, and a light receiving element. The SPR sensor cell includes a plurality of optical waveguides. At least one of the plurality of optical waveguides forms a detection unit together with a metal layer onto which a recognition substance for an object to be inspected is fixed, and at least another one of the plurality of optical waveguides forms a reference unit together with a metal layer free of the recognition substance.

Abstract: Heat-assisted wiring traces and a conductive support substrate are respectively formed on first and second surfaces of an insulating layer. Further, connection terminals electrically insulated from the support substrate and electrically respectively connected to the heat-assisted wiring traces are formed on the second surface of the insulating layer. Each connection terminal has an element connection portion, a pattern connection portion and a spread blocking portion. When a circuit element is connected to the element connection portion of the connection terminal by solder, spreading of a molten solder applied to the element connection portion to the pattern connection portion is blocked by the spread blocking portion.

Abstract: A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove.

Abstract: A plurality of suspension boards are integrally supported by a support frame. A plurality of inspection substrates are provided to correspond to the plurality of suspension boards. In each suspension board, lines are formed on a conductive support substrate with a base insulating layer sandwiched therebetween. The support substrate and the line are electrically connected by a via in the base insulating layer. In each inspection substrate, a conductor layer is formed on a conductive support substrate with a base insulating layer sandwiched therebetween. The support substrate and the conductor layer are electrically connected by a via in the base insulating layer.

Abstract: A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove.

Abstract: A plurality of suspension boards and an inspection substrate are integrally supported by a support frame. In each suspension board, a line is formed on a conductive first support substrate via a first insulating layer. The first support substrate and the line are electrically connected by a first via in the first insulating layer. In the inspection substrate, a conductor layer is formed on a conductive second support substrate with a second insulating layer sandwiched therebetween. The second support substrate and the conductor layer are electrically connected by a second via in the second insulating layer. The first via and the second via have the same configuration.

Abstract: A determination mark formation portion is provided in each suspension board. In the determination mark formation portion, a recess having a given depth is provided in a base insulating layer. An outer peripheral portion is formed on the base insulating layer to surround the recess. A plating layer is formed on the outer peripheral portion. A circular hole is formed on a support substrate. The hole of the support substrate and the recess of the base insulating layer overlap each other.

Abstract: In a suspension board, a conductor layer having a predetermined pattern is formed on the upper surface of a first insulating layer. The first insulating layer has a thick portion having a large thickness and a thin portion having a small thickness. A reinforcing layer is formed on the upper surface of the first insulating layer so as to overlap with a boundary between the thick portion and the thin portion.

Abstract: A plurality of suspension boards are integrally supported by a support frame. A plurality of inspection substrates are provided to correspond to the plurality of suspension boards. In each suspension board, lines are formed on a conductive support substrate with a base insulating layer sandwiched therebetween. The support substrate and the line are electrically connected by a via in the base insulating layer. In each inspection substrate, a conductor layer is formed on a conductive support substrate with a base insulating layer sandwiched therebetween. The support substrate and the conductor layer are electrically connected by a via in the base insulating layer.