Patents by Inventor Terukazu MOTOSAWA

Terukazu MOTOSAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device manufacturing method
    Patent number: 8987148
    Abstract: With a stage kept in an as-heated state, a semiconductor wafer is placed over the stage. Then, with the elapse of a first time, a controller causes a pressure inside a vacuum chamber to rise to a second pressure higher than a first pressure (step S40). After the semiconductor wafer is placed over the stage, a pressure difference between a pressure inside the vacuum chamber and a pressure inside an adsorption port is set to a minimum value at which the semiconductor wafer is not allowed to slide over protrusions. Further, in step S40 as well, the pressure difference is kept at the minimum value at which the semiconductor wafer is not allowed to slide over the protrusions.
    Type: Grant
    Filed: March 7, 2012
    Date of Patent: March 24, 2015
    Assignee: Renesas Electronics Corporation
    Inventors: Misato Sakamoto, Yoshitake Katou, Youichi Yamamoto, Takashi Kyouno, Chikara Yamamoto, Terukazu Motosawa, Mitsuo Maeda, Hiroshi Itou
  • SEMICONDUCTOR DEVICE MANUFACTURING METHOD
    Publication number: 20120238043
    Abstract: With the stage kept in an as-heated state, the semiconductor wafer is placed over the stage (step S10). Then, with the elapse of first time, a controller causes a pressure inside a vacuum chamber to rise to a second pressure higher than a first pressure (step S40). After the semiconductor wafer is placed over the stage, a pressure difference between a pressure inside the vacuum chamber and a pressure inside the adsorption port is set to a minimum value at which the semiconductor wafer is not allowed to slide over the protrusions. Further, in step S40 as well, the pressure difference is kept at the minimum value at which the semiconductor wafer is not allowed to slide over the protrusions.
    Type: Application
    Filed: March 7, 2012
    Publication date: September 20, 2012
    Inventors: Misato SAKAMOTO, Yoshitake KATOU, Youichi YAMAMOTO, Takashi KYOUNO, Chikara YAMAMOTO, Terukazu MOTOSAWA, Mitsuo MAEDA, Hiroshi ITOU