Patents by Inventor Teruki Edahiro

Teruki Edahiro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Component mounting board, process for producing the board, and process for producing the module
    Patent number: 6165595
    Abstract: A parts-packaging substrate comprising a metal wiring plate having a mask coated on its surface with several openings. This structure eliminates the need for a thick base formed of an insulating body and a resist layer required in prior art substrates. By bending a terminal of the metal wiring plate to form a connecting terminal, a connector used to connect to another substrate can be eliminated, reducing the cost of manufacture.
    Type: Grant
    Filed: February 9, 1998
    Date of Patent: December 26, 2000
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Koichi Kumagai, Yoshinori Wada, Teruki Edahiro